Issued Patents All Time
Showing 51–73 of 73 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7882624 | Method of forming electronic package having fluid-conducting channel | Ravi Mahajan | 2011-02-08 |
| 7713839 | Diamond substrate formation for electronic assemblies | Gregory M. Chrysler, Daoqiang Lu | 2010-05-11 |
| 7682876 | Electronic assemblies having a low processing temperature | Daoqiang Lu | 2010-03-23 |
| 7646093 | Thermal management of dies on a secondary side of a package | Henning Braunisch, Gloria Alejandra Camacho Bragado | 2010-01-12 |
| 7626251 | Microelectronic die assembly having thermally conductive element at a backside thereof and method of making same | Daoqiang Lu, Dongming He | 2009-12-01 |
| 7560640 | Densely packed thermoelectric cooler | David Chau | 2009-07-14 |
| 7531429 | Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices | Peter G. Tolchinsky, Irwin Yablok, Richard Emery | 2009-05-12 |
| 7495630 | Feed point adjustable planar antenna | Yu-Wei Chen, Chang-Lun Liao, Chia-Sheng Liu | 2009-02-24 |
| 7476568 | Wafer-level assembly of heat spreaders for dual IHS packages | Daoqiang Lu, Rajashree Baskaran | 2009-01-13 |
| 7420273 | Thinned die integrated circuit package | Cheng-Yi Liu, Johanna M. Swan, Steven Towle | 2008-09-02 |
| 7397119 | Wafer-level diamond spreader | Gregory M. Chrysler | 2008-07-08 |
| 7382323 | Micro chip antenna | Meng Chiu Pan, Shun-Tian Lin, Chang-Fa Yang, Kao Chung Cheng, Sea-Fue Wang +3 more | 2008-06-03 |
| 7319048 | Electronic assemblies having a low processing temperature | Daoqiang Lu | 2008-01-15 |
| 7301461 | SOC for integrating micro-antenna | Shun-Tian Lin, Chang-Fa Yang | 2007-11-27 |
| 7279796 | Microelectronic die having a thermoelectric module | Gregory M. Chrysler, Ravi Mahajan | 2007-10-09 |
| 7259965 | Integrated circuit coolant microchannel assembly with targeted channel configuration | Je-Young Chang, Ioan Sauciuc, Chia-Pin Chiu, Gregory M. Chrysler, Ravi Prasher +3 more | 2007-08-21 |
| 7126822 | Electronic packages, assemblies, and systems with fluid cooling | Ravi Mahajan | 2006-10-24 |
| 7095111 | Package with integrated wick layer and method for heat removal | Richard Emery | 2006-08-22 |
| 7091108 | Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices | Peter G. Tolchinsky, Irwin Yablok, Richard Emery | 2006-08-15 |
| 7038316 | Bumpless die and heat spreader lid module bonded to bumped die carrier | Daoqiang Lu, Zhiyong Wang, Gilroy Vandentop | 2006-05-02 |
| 7012011 | Wafer-level diamond spreader | Gregory M. Chrysler | 2006-03-14 |
| 7009289 | Fluxless die-to-heat spreader bonding using thermal interface material | Daoqiang Lu | 2006-03-07 |
| 6833289 | Fluxless die-to-heat spreader bonding using thermal interface material | Daoqiang Lu | 2004-12-21 |