| 7888183 |
Thinned die integrated circuit package |
Cheng-Yi Liu, Johanna M. Swan, Chuan Hu |
2011-02-15 |
$18,725,000 |
| 7589417 |
Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same |
Shriram Ramanathan, Gregory M. Chrysler |
2009-09-15 |
$19,566,000 |
| 7420273 |
Thinned die integrated circuit package |
Cheng-Yi Liu, Johanna M. Swan, Chuan Hu |
2008-09-02 |
$25,184,000 |
| 7372120 |
Methods and apparatus to optically couple an optoelectronic chip to a waveguide |
Henning Braunisch, Gilroy Vandentop, Daoqiang Lu |
2008-05-13 |
$17,373,000 |
| 7369718 |
Package substrate pattern to accommodate optical waveguide |
— |
2008-05-06 |
$19,899,000 |
| 7256059 |
Underfill integration for optical packages |
Daoqiang Lu |
2007-08-14 |
$18,880,000 |
| 7236666 |
On-substrate microlens to couple an off-substrate light emitter and/or receiver with an on-substrate optical device |
Henning Braunisch, Daoqiang Lu, Gilroy Vandentop |
2007-06-26 |
$20,503,000 |
| 7226812 |
Wafer support and release in wafer processing |
Daoqiang Lu |
2007-06-05 |
$17,840,000 |
| 7189596 |
Process for forming a direct build-up layer on an encapsulated die packages utilizing intermediate structures |
Chun Mu, Qing Ma, Quat Vu |
2007-03-13 |
$17,337,000 |
| 7183658 |
Low cost microelectronic circuit package |
John Tang, John Cuendet, Henning Braunisch, Thomas Dory |
2007-02-27 |
$10,067,000 |
| 7177504 |
Manufacturable connectorization process for optical chip-to-chip interconnects |
Henning Braunisch, Daoqiang Lu |
2007-02-13 |
$12,105,000 |
| 7085449 |
Waveguide coupling mechanism |
Henning Braunisch, Daoqiang Lu, Gilroy Vandentop |
2006-08-01 |
$14,842,000 |
| 7078788 |
Microelectronic substrates with integrated devices |
Quat Vu, Jian Li |
2006-07-18 |
$11,508,000 |
| 7071024 |
Method for packaging a microelectronic device using on-die bond pad expansion |
Martha Jones, Quat Vu |
2006-07-04 |
|
| 7067356 |
Method of fabricating microelectronic package having a bumpless laminated interconnection layer |
Paul H. Wermer |
2006-06-27 |
$17,073,000 |
| 7042106 |
Underfill integration for optical packages |
Daoqiang Lu |
2006-05-09 |
$14,660,000 |
| 7039263 |
Electrooptic assembly |
— |
2006-05-02 |
$12,289,000 |
| 7012015 |
Wafer-level thick film standing-wave clocking |
Henning Braunisch |
2006-03-14 |
$16,541,000 |
| 6977435 |
Thick metal layer integrated process flow to improve power delivery and mechanical buffering |
Sarah Kim, Bob Martell, Dave Ayers, R. Scott List, Peter K. Moon |
2005-12-20 |
$37,307,000 |
| 6975017 |
Healing of micro-cracks in an on-chip dielectric |
Anna George |
2005-12-13 |
$11,810,000 |
| 6943440 |
Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow |
Sarah Kim, Kevin J. Lee |
2005-09-13 |
$17,645,000 |
| 6927496 |
Wafer-level thick film standing-wave clocking |
Henning Braunisch |
2005-08-09 |
$18,014,000 |
| 6894399 |
Microelectronic device having signal distribution functionality on an interfacial layer thereof |
Quat Vu, Tuy T. Ton |
2005-05-17 |
$25,995,000 |
| 6888240 |
High performance, low cost microelectronic circuit package with interposer |
John Tang, Gilroy Vandentop |
2005-05-03 |
$20,343,000 |
| 6846737 |
Plasma induced depletion of fluorine from surfaces of fluorinated low-k dielectric materials |
Ebrahim Andideh, Lawrence Wong |
2005-01-25 |
$26,797,000 |
