Issued Patents All Time
Showing 25 most recent of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7888183 | Thinned die integrated circuit package | Cheng-Yi Liu, Johanna M. Swan, Chuan Hu | 2011-02-15 |
| 7589417 | Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same | Shriram Ramanathan, Gregory M. Chrysler | 2009-09-15 |
| 7420273 | Thinned die integrated circuit package | Cheng-Yi Liu, Johanna M. Swan, Chuan Hu | 2008-09-02 |
| 7372120 | Methods and apparatus to optically couple an optoelectronic chip to a waveguide | Henning Braunisch, Gilroy Vandentop, Daoqiang Lu | 2008-05-13 |
| 7369718 | Package substrate pattern to accommodate optical waveguide | — | 2008-05-06 |
| 7256059 | Underfill integration for optical packages | Daoqiang Lu | 2007-08-14 |
| 7236666 | On-substrate microlens to couple an off-substrate light emitter and/or receiver with an on-substrate optical device | Henning Braunisch, Daoqiang Lu, Gilroy Vandentop | 2007-06-26 |
| 7226812 | Wafer support and release in wafer processing | Daoqiang Lu | 2007-06-05 |
| 7189596 | Process for forming a direct build-up layer on an encapsulated die packages utilizing intermediate structures | Chun Mu, Qing Ma, Quat Vu | 2007-03-13 |
| 7183658 | Low cost microelectronic circuit package | John Tang, John Cuendet, Henning Braunisch, Thomas Dory | 2007-02-27 |
| 7177504 | Manufacturable connectorization process for optical chip-to-chip interconnects | Henning Braunisch, Daoqiang Lu | 2007-02-13 |
| 7085449 | Waveguide coupling mechanism | Henning Braunisch, Daoqiang Lu, Gilroy Vandentop | 2006-08-01 |
| 7078788 | Microelectronic substrates with integrated devices | Quat Vu, Jian Li | 2006-07-18 |
| 7071024 | Method for packaging a microelectronic device using on-die bond pad expansion | Martha Jones, Quat Vu | 2006-07-04 |
| 7067356 | Method of fabricating microelectronic package having a bumpless laminated interconnection layer | Paul H. Wermer | 2006-06-27 |
| 7042106 | Underfill integration for optical packages | Daoqiang Lu | 2006-05-09 |
| 7039263 | Electrooptic assembly | — | 2006-05-02 |
| 7012015 | Wafer-level thick film standing-wave clocking | Henning Braunisch | 2006-03-14 |
| 6977435 | Thick metal layer integrated process flow to improve power delivery and mechanical buffering | Sarah Kim, Bob Martell, Dave Ayers, R. Scott List, Peter K. Moon | 2005-12-20 |
| 6975017 | Healing of micro-cracks in an on-chip dielectric | Anna George | 2005-12-13 |
| 6943440 | Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow | Sarah Kim, Kevin J. Lee | 2005-09-13 |
| 6927496 | Wafer-level thick film standing-wave clocking | Henning Braunisch | 2005-08-09 |
| 6894399 | Microelectronic device having signal distribution functionality on an interfacial layer thereof | Quat Vu, Tuy T. Ton | 2005-05-17 |
| 6888240 | High performance, low cost microelectronic circuit package with interposer | John Tang, Gilroy Vandentop | 2005-05-03 |
| 6846737 | Plasma induced depletion of fluorine from surfaces of fluorinated low-k dielectric materials | Ebrahim Andideh, Lawrence Wong | 2005-01-25 |