Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow

Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow

US Patent 6943440 · Granted Sep 13, 2005

Estimated economic value: $17,645,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Content playback based on a path2025
Systems and methods of managing spatial groups in multi-user communication sessi2024
Systems and methods of managing spatial groups in multi-user communication sessi2024
Temporarily suspending spatial constraints2024
Stitched sensor for deleting or measuring acting force2024
Time-based visualization of content anchored in time2024
Systems and methods for configuring and implementing a malicious account testing2023
Damascene-based approaches for embedding spin hall MTJ devices into a logic proc2022
Systems and methods for configuring and implementing a card testing machine lear2022
Approaches for embedding spin hall MTJ devices into a logic processor and the re2022
Semiconductor device package comprising thermal interface layer and method of fa2022
Method and apparatus for forming backside die planar devices and saw filter2021