| 12092535 |
Stitched sensor for deleting or measuring acting force |
Paul Hofmann |
2024-09-17 |
|
| 11232996 |
Semiconductor device package comprising thermal interface layer and method of fabricating of the same |
Sunyong Lee, Tae Hyeob Im |
2022-01-25 |
|
| 10327285 |
Heating element and method for manufacturing same |
Jiehyun Seong, Hyeon Choi, Seung Heon Lee |
2019-06-18 |
|
| 8421225 |
Three-dimensional stacked substrate arrangements |
Shriram Ramanathan, Patrick Morrow, Scott List, Michael Chan, Mauro J. Kobrinsky +3 more |
2013-04-16 |
$28,862,000 |
| 8203208 |
Three-dimensional stacked substrate arrangements |
Shriram Ramanathan, Patrick Morrow, Scott List, Michael Chan, Mauro J. Kobrinsky +3 more |
2012-06-19 |
$20,138,000 |
| 7973407 |
Three-dimensional stacked substrate arrangements |
Shriram Ramanathan, Patrick Morrow, Scott List, Michael Chan, Mauro J. Kobrinsky +3 more |
2011-07-05 |
$27,745,000 |
| 7842553 |
Cooling micro-channels |
R. Scott List, Alan M. Myers |
2010-11-30 |
$13,201,000 |
| 7723208 |
Integrated re-combiner for electroosmotic pumps using porous frits |
R. Scott List, James G. Maveety, Alan M. Myers, Quat Vu |
2010-05-25 |
$11,401,000 |
| 7696015 |
Method of forming a stack of heat generating integrated circuit chips with intervening cooling integrated circuit chips |
R. Scott List, James G. Maveety, Alan M. Myers, Quat Vu |
2010-04-13 |
$20,798,000 |
| 7615462 |
Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stack |
R. Scott List, Tom Letson |
2009-11-10 |
$23,460,000 |
| 7576432 |
Using external radiators with electroosmotic pumps for cooling integrated circuits |
R. Scott List, James G. Maveety, Alan M. Myers, Quat Vu, Ravi Prasher +2 more |
2009-08-18 |
$24,226,000 |
| 7537954 |
Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same |
Shriram Ramanathan, R. Scott List, Gregory M. Chrysler |
2009-05-26 |
$14,272,000 |
| 7410884 |
3D integrated circuits using thick metal for backside connections and offset bumps |
Shriram Ramanathan, Patrick Morrow |
2008-08-12 |
$20,410,000 |
| 7348217 |
Method and structure for interfacing electronic devices |
Mauro J. Kobrinsky, R. Scott List, Michael C. Harmes |
2008-03-25 |
$11,219,000 |
| 7274106 |
Packaged electroosmotic pumps using porous frits for cooling integrated circuits |
R. Scott List, James G. Maveety, Alan M. Myers, Quat Vu |
2007-09-25 |
$25,540,000 |
| 7271434 |
Capacitor with insulating nanostructure |
Scot Kellar |
2007-09-18 |
$14,997,000 |
| 7265406 |
Capacitor with conducting nanostructure |
Scot Kellar |
2007-09-04 |
$18,654,000 |
| 7244983 |
Method and device for on-chip decoupling capacitor using nanostructures as bottom electrode |
Scot Kellar |
2007-07-17 |
$13,694,000 |
| 7227257 |
Cooling micro-channels |
R. Scott List, Alan M. Myers |
2007-06-05 |
$17,840,000 |
| 7183648 |
Method and apparatus for low temperature copper to copper bonding |
Shriram Ramanathan |
2007-02-27 |
$10,067,000 |
| 7157787 |
Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices |
R. Scott List, Scot Kellar |
2007-01-02 |
|
| 7148565 |
Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stack |
R. Scott List, Tom Letson |
2006-12-12 |
$16,980,000 |
| 7105382 |
Self-aligned electrodes contained within the trenches of an electroosmotic pump |
Alan M. Myers, R. Scott List |
2006-09-12 |
$13,412,000 |
| 7105925 |
Differential planarization |
James A. Boardman, Paul B. Fischer, Mauro J. Kobrinsky |
2006-09-12 |
$13,412,000 |
| 7091084 |
Ultra-high capacitance device based on nanostructures |
Scot Kellar |
2006-08-15 |
$13,533,000 |
