Issued Patents All Time
Showing 25 most recent of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12092535 | Stitched sensor for deleting or measuring acting force | Paul Hofmann | 2024-09-17 |
| 11232996 | Semiconductor device package comprising thermal interface layer and method of fabricating of the same | Sunyong Lee, Tae Hyeob Im | 2022-01-25 |
| 10327285 | Heating element and method for manufacturing same | Jiehyun Seong, Hyeon Choi, Seung Heon Lee | 2019-06-18 |
| 8421225 | Three-dimensional stacked substrate arrangements | Shriram Ramanathan, Patrick Morrow, Scott List, Michael Chan, Mauro J. Kobrinsky +3 more | 2013-04-16 |
| 8203208 | Three-dimensional stacked substrate arrangements | Shriram Ramanathan, Patrick Morrow, Scott List, Michael Chan, Mauro J. Kobrinsky +3 more | 2012-06-19 |
| 7973407 | Three-dimensional stacked substrate arrangements | Shriram Ramanathan, Patrick Morrow, Scott List, Michael Chan, Mauro J. Kobrinsky +3 more | 2011-07-05 |
| 7842553 | Cooling micro-channels | R. Scott List, Alan M. Myers | 2010-11-30 |
| 7723208 | Integrated re-combiner for electroosmotic pumps using porous frits | R. Scott List, James G. Maveety, Alan M. Myers, Quat Vu | 2010-05-25 |
| 7696015 | Method of forming a stack of heat generating integrated circuit chips with intervening cooling integrated circuit chips | R. Scott List, James G. Maveety, Alan M. Myers, Quat Vu | 2010-04-13 |
| 7615462 | Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stack | R. Scott List, Tom Letson | 2009-11-10 |
| 7576432 | Using external radiators with electroosmotic pumps for cooling integrated circuits | R. Scott List, James G. Maveety, Alan M. Myers, Quat Vu, Ravi Prasher +2 more | 2009-08-18 |
| 7537954 | Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same | Shriram Ramanathan, R. Scott List, Gregory M. Chrysler | 2009-05-26 |
| 7410884 | 3D integrated circuits using thick metal for backside connections and offset bumps | Shriram Ramanathan, Patrick Morrow | 2008-08-12 |
| 7348217 | Method and structure for interfacing electronic devices | Mauro J. Kobrinsky, R. Scott List, Michael C. Harmes | 2008-03-25 |
| 7274106 | Packaged electroosmotic pumps using porous frits for cooling integrated circuits | R. Scott List, James G. Maveety, Alan M. Myers, Quat Vu | 2007-09-25 |
| 7271434 | Capacitor with insulating nanostructure | Scot Kellar | 2007-09-18 |
| 7265406 | Capacitor with conducting nanostructure | Scot Kellar | 2007-09-04 |
| 7244983 | Method and device for on-chip decoupling capacitor using nanostructures as bottom electrode | Scot Kellar | 2007-07-17 |
| 7227257 | Cooling micro-channels | R. Scott List, Alan M. Myers | 2007-06-05 |
| 7183648 | Method and apparatus for low temperature copper to copper bonding | Shriram Ramanathan | 2007-02-27 |
| 7157787 | Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices | R. Scott List, Scot Kellar | 2007-01-02 |
| 7148565 | Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stack | R. Scott List, Tom Letson | 2006-12-12 |
| 7105382 | Self-aligned electrodes contained within the trenches of an electroosmotic pump | Alan M. Myers, R. Scott List | 2006-09-12 |
| 7105925 | Differential planarization | James A. Boardman, Paul B. Fischer, Mauro J. Kobrinsky | 2006-09-12 |
| 7091084 | Ultra-high capacitance device based on nanostructures | Scot Kellar | 2006-08-15 |