Issued Patents All Time
Showing 25 most recent of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9869714 | Integrated circuit test temperature control mechanism | John C. Johnson, Abram M. Detofsky, James Neeb | 2018-01-16 |
| 9448278 | Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same | Christopher R. Schroeder, Christopher Wade Ackerman, James C. Shipley, Tolga Acikalin, Ioan Sauciuc +2 more | 2016-09-20 |
| 9406582 | Apparatus to minimize thermal impedance using copper on die backside | Fay Hua, Gregory M. Chrysler, Kramadhati V. Ravi | 2016-08-02 |
| 9400291 | Integrated circuit test temperature control mechanism | John C. Johnson, Abram M. Detofsky, James Neeb | 2016-07-26 |
| 9347987 | Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same | Christopher R. Schroeder, Christopher Wade Ackerman, James C. Shipley, Tolga Acikalin, Ioan Sauciuc +2 more | 2016-05-24 |
| 9046569 | Seal method for direct liquid cooling of probes used at first level interconnect | Ronald Michael Kirby, Joe Walczyk | 2015-06-02 |
| 8891235 | Thermal interface for multi-chip packages | Joseph F. Walczyk, Jin Yang, Todd P. Albertson, Ashish Gupta, Jin Pan +1 more | 2014-11-18 |
| 8623705 | Nanotube based vapor chamber for die level cooling | Unnikrishnan Vadakkanmaruveedu, Gregory M. Chrysler | 2014-01-07 |
| 8505613 | Die having a via filled with a heat-dissipating material | Gregory M. Chrysler | 2013-08-13 |
| 8404519 | Process that includes assembling together first and second substrates the have respective first and second carbon nanotube arrays with geometrically complementary patterns | Gregory M. Chrysler, Thomas Dory, Edward R. Prack, Unnikrishnan Vadakkanmaruveedu | 2013-03-26 |
| 8125075 | Carbon nanotube micro-chimney and thermo siphon die-level cooling | Gregory M. Chrysler, Unnikrishnan Vadakkanmaruveedu | 2012-02-28 |
| 8006747 | Micro-chimney and thermosiphon die-level cooling | Gregory M. Chrysler | 2011-08-30 |
| 7964447 | Process of making carbon nanotube array that includes impregnating the carbon nanotube array with metal | Gregory M. Chrysler, Thomas Dory, Edward R. Prack, Unnikrishnan Vadakkanmaruveedu | 2011-06-21 |
| 7911052 | Nanotube based vapor chamber for die level cooling | Unnikrishnan Vadakkanmaruveedu, Gregory M. Chrysler | 2011-03-22 |
| 7886813 | Thermal interface material with carbon nanotubes and particles | Fay Hua | 2011-02-15 |
| 7723208 | Integrated re-combiner for electroosmotic pumps using porous frits | Sarah Kim, R. Scott List, Alan M. Myers, Quat Vu | 2010-05-25 |
| 7696015 | Method of forming a stack of heat generating integrated circuit chips with intervening cooling integrated circuit chips | Sarah Kim, R. Scott List, Alan M. Myers, Quat Vu | 2010-04-13 |
| 7576432 | Using external radiators with electroosmotic pumps for cooling integrated circuits | Sarah Kim, R. Scott List, Alan M. Myers, Quat Vu, Ravi Prasher +2 more | 2009-08-18 |
| 7545030 | Article having metal impregnated within carbon nanotube array | Gregory M. Chrysler, Thomas Dory, Edward R. Prack, Unnikrishnan Vadakkanmaruveedu | 2009-06-09 |
| 7492041 | Diamond-silicon hybrid integrated heat spreader | Kramadhati V. Ravi | 2009-02-17 |
| 7487822 | Micro-chimney and thermosiphon die-level cooling | Gregory M. Chrysler | 2009-02-10 |
| 7449780 | Apparatus to minimize thermal impedance using copper on die backside | Fay Hua, Gregory M. Chrysler, Kramadhati V. Ravi | 2008-11-11 |
| 7428138 | Forming carbon nanotube capacitors | Larry E. Mosley, Edward R. Prack | 2008-09-23 |
| 7335983 | Carbon nanotube micro-chimney and thermo siphon die-level cooling | Gregory M. Chrysler, Unnikrishnan Vadakkanmaruveedu | 2008-02-26 |
| 7274106 | Packaged electroosmotic pumps using porous frits for cooling integrated circuits | Sarah Kim, R. Scott List, Alan M. Myers, Quat Vu | 2007-09-25 |