Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12197357 | High performance interconnect | Robert J. Safranek, Robert G. Blankenship, Venkatraman Iyer, Jeff Willey, Robert Beers +18 more | 2025-01-14 |
| 12189550 | High performance interconnect | Robert J. Safranek, Robert G. Blankenship, Venkatraman Iyer, Jeff Willey, Robert Beers +18 more | 2025-01-07 |
| 11741030 | High performance interconnect | Robert J. Safranek, Robert G. Blankenship, Venkatraman Iyer, Jeff Willey, Robert Beers +18 more | 2023-08-29 |
| 11269793 | High performance interconnect | Robert J. Safranek, Robert G. Blankenship, Venkatraman Iyer, Jeff Willey, Robert Beers +18 more | 2022-03-08 |
| 10909055 | High performance interconnect physical layer | Venkatraman Iyer, Darren S. Jue, Robert G. Blankenship, Fulvio Spagna | 2021-02-02 |
| 10380046 | High performance interconnect physical layer | Venkatraman Iyer, Darren S. Jue, Robert G. Blankenship, Fulvio Spagna | 2019-08-13 |
| 10357939 | High performance light weight carbon fiber fabric-electrospun carbon nanofibers hybrid polymer composites | Sanjay Ragnath Dhakate, Anisha Chaudhary, Rakesh Mathur | 2019-07-23 |
| 10248591 | High performance interconnect | Robert J. Safranek, Robert G. Blankenship, Venkatraman Iyer, Jeff Willey, Robert Beers +18 more | 2019-04-02 |
| 9916266 | High performance interconnect physical layer | Venkatraman Iyer, Darren S. Jue, Robert G. Blankenship, Fulvio Spagna | 2018-03-13 |
| 9865521 | Copper nanorod-based thermal interface material (TIM) | Chandra Mohan Jha, Feras Eid, Johanna M. Swan | 2018-01-09 |
| 9626321 | High performance interconnect | Robert J. Safranek, Robert G. Blankenship, Venkatraman Iyer, Jeff Willey, Robert Beers +18 more | 2017-04-18 |
| 9601406 | Copper nanorod-based thermal interface material (TIM) | Chandra Mohan Jha, Feras Eid, Johanna M. Swan | 2017-03-21 |
| 9477275 | Thermal management solution for circuit products | Arnab Choudhury, Je-Young Chang, David W. Song, Edvin Cetegen | 2016-10-25 |
| 9448278 | Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same | Christopher R. Schroeder, Christopher Wade Ackerman, James C. Shipley, Tolga Acikalin, Ioan Sauciuc +2 more | 2016-09-20 |
| 9418035 | High performance interconnect physical layer | Venkatraman Iyer, Darren S. Jue, Robert G. Blankenship, Fulvio Spagna | 2016-08-16 |
| 9347987 | Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same | Christopher R. Schroeder, Christopher Wade Ackerman, James C. Shipley, Tolga Acikalin, Ioan Sauciuc +2 more | 2016-05-24 |
| 8891235 | Thermal interface for multi-chip packages | Joseph F. Walczyk, Jin Yang, James G. Maveety, Todd P. Albertson, Jin Pan +1 more | 2014-11-18 |
| 8410802 | System including thermal control unit having conduit for dispense and removal of liquid thermal interface material | James Hastings, Nader N. Abazarnia, Suzana Prstic, Jerome L. Garcia | 2013-04-02 |
| 7982478 | Liquid TIM dispense and removal method and assembly | Nader N. Abazarnia, Suzana Prstic | 2011-07-19 |
| 7376775 | Apparatus, system, and method to enable transparent memory hot plug/remove | Lily P. Looi, Stanley Steven Kulick, Dean Mulla, Keith Robert Pflederer, Shivnandan Kaushik +2 more | 2008-05-20 |
| 7328375 | Pass through debug port on a high speed asynchronous link | Bahaa Fahim, Kent A. Dickey, Jonathan C. Jasper | 2008-02-05 |
| 7249273 | Synchronized serial interface | Chengting Zhao, Edward R. Helder, Fangxing Wei | 2007-07-24 |