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Thermal management of molded packages |
Feras Eid, Johanna M. Swan, Taesha D. Beasley, Sasha N. Oster, Tannaz Harirchian +1 more |
2019-09-24 |
| 10281521 |
System for thermal management of device under test (DUT) |
David W. Song, James Hastings, Akhilesh Rallabandi, Morten S. Jensen, Christopher Wade Ackerman +2 more |
2019-05-07 |
| 10261121 |
Diamond-like carbon coated semiconductor equipment |
Jelena Culic-Viskota |
2019-04-16 |
| 10228418 |
Alignment fixtures for an integrated circuit packages |
Sruti Chigullapalli, Rene J. Sanchez, Todd Coons, Tuan Hoong Goh |
2019-03-12 |
| 9638747 |
Placing integrated circuit devices using perturbation |
Paul Diglio, Christopher R. Schroeder, Rene J. Sanchez, Morten S. Jensen |
2017-05-02 |
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System including thermal control unit having conduit for dispense and removal of liquid thermal interface material |
Ashish Gupta, James Hastings, Suzana Prstic, Jerome L. Garcia |
2013-04-02 |
| 7982478 |
Liquid TIM dispense and removal method and assembly |
Ashish Gupta, Suzana Prstic |
2011-07-19 |
| 6898852 |
Connector assembly with decoupling capacitors |
Jeffrey H. Luke, James Neeb |
2005-05-31 |
| 6819130 |
Floating and self-aligning suspension system to automatically align and attach a connector to an assembly |
Jeffrey H. Luke, Nader Shahriari |
2004-11-16 |
| 6621287 |
Connector assembly with decoupling capacitors |
Jeffrey H. Luke, James Neeb |
2003-09-16 |