| 12500137 |
Directly impinging pressure modulated spray cooling and methods of target temperature control |
Prabhakar Subrahmanyam, Tewodros Fiseha Wondimu, Ying-Feng PANG, Muhammad Waseem Ahmad, David Shia +1 more |
2025-12-16 |
|
| 12493151 |
Method and device for fast, passive alignment in photonics assembly |
Vineeth John Abraham, Wesley B. Morgan, Eric J. M. Moret, Srikant Nekkanty |
2025-12-09 |
|
| 12411296 |
Reworkable zero-force insertion electrical optical package socket and method |
Eric J. M. Moret, Pooya Tadayon, Karumbu Meyyappan |
2025-09-09 |
|
| 12392818 |
Enhanced jet impingement leak prevention for integrated circuit |
Ruben Nunez Blanco, Christopher Wade Ackerman, Varun Narayan, Craig Yost, Jensen STENBERG +3 more |
2025-08-19 |
|
| 12136577 |
Integrated circuit die packages including a contiguous heat spreader |
Feras Eid, Joe Walczyk |
2024-11-05 |
$48,202,000 |
| 12080620 |
Additively manufactured structures for heat dissipation from integrated circuit devices |
Feras Eid, Xavier Francois Brun, Joe Walczyk, Sergio Antonio Chan Arguedas |
2024-09-03 |
$14,017,000 |
| 12057370 |
Vacuum modulated two phase cooling loop efficiency and parallelism enhancement |
Pooya Tadayon, David Shia |
2024-08-06 |
$17,070,000 |
| 12021016 |
Thermally enhanced silicon back end layers for improved thermal performance |
Chandra Mohan Jha, Pooya Tadayon, Aastha Uppal, Weihua Tang, Xavier Francois Brun |
2024-06-25 |
$22,163,000 |
| 12000487 |
System and apparatus having a seal member for sealing of a device under test |
Craig Yost, Christopher Wade Ackerman |
2024-06-04 |
$24,500,000 |
| 11976671 |
Vacuum modulated two phase cooling loop performance enhancement |
Pooya Tadayon, David Shia |
2024-05-07 |
$26,756,000 |
| 11808988 |
Method and device for fast, passive alignment in photonics assembly |
Vineeth John Abraham, Wesley B. Morgan, Eric J. M. Moret, Srikant Nekkanty |
2023-11-07 |
$22,371,000 |
| 11762157 |
Method and system for attaching optical fibers to warped photonic chips |
Sufi Ahmed, Vineeth John Abraham, Eric J. M. Moret |
2023-09-19 |
$20,015,000 |
| 11674980 |
Low-profile gimbal platform for high-resolution in situ co-planarity adjustment |
Joseph F. Walczyk |
2023-06-13 |
$22,204,000 |
| 11543454 |
Double-beam test probe |
Pooya Tadayon, Karumbu Meyyappan |
2023-01-03 |
$15,575,000 |
| 11073538 |
Electrical testing apparatus with lateral movement of a probe support substrate |
Joe Walczyk |
2021-07-27 |
$27,337,000 |
| 10775414 |
Low-profile gimbal platform for high-resolution in situ co-planarity adjustment |
Joseph F. Walczyk |
2020-09-15 |
$34,212,000 |
| 10499461 |
Thermal head with a thermal barrier for integrated circuit die processing |
Mohit Mamodia, Kyle Yazzie, Dingying Xu, Kuang Liu, Pramod Malatkar |
2019-12-03 |
$19,496,000 |
| 10393592 |
Systems and methods for measuring surface temperature |
— |
2019-08-27 |
$17,353,000 |
| 10030916 |
Fluid flow channel for enhanced heat transfer efficiency |
Phi Thanh, John C. Johnson, Jarett Rinaldi, Arnab Choudhury |
2018-07-24 |
$23,531,000 |
| 9791501 |
Compliant thermal contact device and method |
David W. Song |
2017-10-17 |
$9,876,000 |
| 9638747 |
Placing integrated circuit devices using perturbation |
Nader N. Abazarnia, Christopher R. Schroeder, Rene J. Sanchez, Morten S. Jensen |
2017-05-02 |
$12,076,000 |
| 9377486 |
Thermal interface material handling for thermal control of an electronic component under test |
David W. Song, Christopher R. Schroeder, Joseph F. Walczyk, Lothar Kress, Todd Young +4 more |
2016-06-28 |
$11,945,000 |
