Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412868 | Microelectronic assemblies including interconnects with different solder materials | Jeremy Ecton, Jason M. Gamba, Brandon C. Marin, Srinivas V. Pietambaram, Xiaoxuan Sun +6 more | 2025-09-09 |
| 12368089 | Low cost embedded integrated circuit dies | Sanka Ganesan | 2025-07-22 |
| 12347782 | Microelectronic assemblies with direct attach to circuit boards | Sanka Ganesan, William J. Lambert, Bharat P. Penmecha | 2025-07-01 |
| 12341080 | Semiconductor device stack-up with bulk substrate material to mitigate hot spots | Shrenik Kothari, Chandra Mohan Jha, Weihua Tang, Robert L. Sankman, Pooya Tadayon | 2025-06-24 |
| 12176292 | Microelectronic component having molded regions with through-mold vias | Sanka Ganesan, Ram Viswanath, Tarek A. Ibrahim, Jason M. Gamba, Manish Dubey +1 more | 2024-12-24 |
| 12080620 | Additively manufactured structures for heat dissipation from integrated circuit devices | Feras Eid, Paul Diglio, Joe Walczyk, Sergio Antonio Chan Arguedas | 2024-09-03 |
| 12066584 | Fast power on method for marine acquisition streamer | Nicolas Fradin | 2024-08-20 |
| 12021016 | Thermally enhanced silicon back end layers for improved thermal performance | Chandra Mohan Jha, Pooya Tadayon, Aastha Uppal, Weihua Tang, Paul Diglio | 2024-06-25 |
| 12002727 | Barrier structures for underfill containment | Ziyin Lin, Vipul V. Mehta, Wei Li, Edvin Cetegen, Yang Guo +6 more | 2024-06-04 |
| 11978689 | Semiconductor device stack-up with bulk substrate material to mitigate hot spots | Shrenik Kothari, Chandra Mohan Jha, Weihua Tang, Robert L. Sankman, Pooya Tadayon | 2024-05-07 |
| 11817390 | Microelectronic component having molded regions with through-mold vias | Sanka Ganesan, Ram Viswanath, Tarek A. Ibrahim, Jason M. Gamba, Manish Dubey +1 more | 2023-11-14 |
| 11804470 | Wafer level passive heat spreader interposer to enable improved thermal solution for stacked dies in multi-chips package and warpage control | Kaizad Mistry, Paul R. Start, Nisha Ananthakrishnan, Yawei Liang, Jigneshkumar P. Patel +2 more | 2023-10-31 |
| 11756860 | Semiconductor device stack-up with bulk substrate material to mitigate hot spots | Shrenik Kothari, Chandra Mohan Jha, Weihua Tang, Robert L. Sankman, Pooya Tadayon | 2023-09-12 |
| 11705417 | Backside metallization (BSM) on stacked die packages and external silicon at wafer level, singulated die level, or stacked dies level | Chandra Mohan Jha, Prasad Ramanathan, Jimmin Yao, Mark R. Allen | 2023-07-18 |
| 11640942 | Microelectronic component having molded regions with through-mold vias | Sanka Ganesan, Ram Viswanath, Tarek A. Ibrahim, Jason M. Gamba, Manish Dubey +1 more | 2023-05-02 |
| 11480699 | Fast power on method for marine acquisition streamer | Nicolas Fradin | 2022-10-25 |
| 11302643 | Microelectronic component having molded regions with through-mold vias | Sanka Ganesan, Ram Viswanath, Tarek A. Ibrahim, Jason M. Gamba, Manish Dubey +1 more | 2022-04-12 |
| 10071544 | Separation apparatus, separation system, and separation method | Osamu Hirakawa, Masaru Honda, Akira Fukutomi, Takeshi Tamura, Jiro Harada +1 more | 2018-09-11 |
| 10008419 | Separation method, computer storage medium, and separation system | Shinji Okada, Masatoshi Shiraishi, Masatoshi Deguchi, Charles Singleton, Kabirkumar Mirpuri | 2018-06-26 |
| 9956755 | Separation method, separation apparatus, and separation system | Osamu Hirakawa, Masaru Honda, Charles Singleton | 2018-05-01 |
| 9919509 | Peeling device, peeling system and peeling method | Osamu Hirakawa, Naoto Yoshitaka, Masaru Honda, Charles Singleton | 2018-03-20 |
| 9827756 | Separation apparatus, separation system, and separation method | Osamu Hirakawa, Masaru Honda, Charles Singleton | 2017-11-28 |
| 9793151 | Stiffener tape for electronic assembly | Arjun Krishnan, Mohit Mamodia, Dingying Xu | 2017-10-17 |
| 9698108 | Structures to mitigate contamination on a back side of a semiconductor substrate | Shweta Agrawal, Hao Wu, Mohit Mamodia, Shengquan Ou, Hualiang Shi | 2017-07-04 |
| 9679798 | Substrate conveyance apparatus and substrate peeling system | Yasuharu Iwashita, Osamu Hirakawa, Yasutaka SOMA, Takeshi Tamura, Kazutaka Noda +1 more | 2017-06-13 |