Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
MM

Mohit Mamodia — 15 Patents

Intel: 13 patents #3,167 of 30,777Top 15%
UMUniversity Of Massachusetts: 1 patents #755 of 1,810Top 45%
Chandler, AZ: #389 of 3,331 inventorsTop 15%
Arizona: #2,353 of 32,909 inventorsTop 8%
Overall (All Time): #307,048 of 4,157,543Top 8%
15 Patents All Time
Mohit Mamodia has been granted 15 US patents while listed as an inventor at Intel. The first was granted in 2012 and the most recent in May 2022. Mohit Mamodia ranks #307,048 of 4,157,543 US inventors in our database (top 7.4%). Patent records list Mohit Mamodia in Chandler, AZ, US.

Patents per Year

Patents granted per year, 2012 to 2022Bar chart with a peak of 3 patents in 2012.peak 32012: 3 patents20122013: 2 patents20132014: 1 patents20142015: 1 patents20152016: 1 patents20162017: 2 patents20172019: 1 patents20192020: 1 patents20202021: 2 patents20212022: 1 patents2022

Issued Patents All Time

Showing 1–15 of 15 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
11340258 Probe pins with etched tips for electrical die test Joseph D. Stanford, David Craig, Todd P. Albertson, Dingying Xu 2022-05-24 $18,289,000
10998275 Package with cathodic protection for corrosion mitigation Kyle Yazzie 2021-05-04 $37,420,000
10957656 Integrated circuit packages with patterned protective material Kyle Yazzie, Naga Sivakumar Yagnamurthy, Pramod Malatkar, Chia-Pin Chiu, Mark Gallina +3 more 2021-03-23 $29,278,000
10598696 Probe pins with etched tips for electrical die test Joseph D. Stanford, David Craig, Todd P. Albertson, Dingying Xu 2020-03-24 $21,125,000
10499461 Thermal head with a thermal barrier for integrated circuit die processing Kyle Yazzie, Dingying Xu, Kuang Liu, Paul Diglio, Pramod Malatkar 2019-12-03 $19,496,000
9793151 Stiffener tape for electronic assembly Xavier Francois Brun, Arjun Krishnan, Dingying Xu 2017-10-17 $9,876,000
9698108 Structures to mitigate contamination on a back side of a semiconductor substrate Xavier Francois Brun, Shweta Agrawal, Hao Wu, Shengquan Ou, Hualiang Shi 2017-07-04
9406618 Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same John S. Guzek, Ravi Kiran Nalla, Javier Solo Gonzalez, Drew W. Delaney, Suresh Pothukuchi +2 more 2016-08-02 $8,723,000
9165914 Forming die backside coating structures with coreless packages Rahul N. Manepalli, David Xu, Javier Soto Gonzalez, Edward R. Prack 2015-10-20 $14,675,000
8786066 Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same John S. Guzek, Ravi Kiran Nalla, Javier Soto Gonzalez, Drew W. Delaney, Suresh Pothukuchi +2 more 2014-07-22 $29,002,000
8569108 Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die Dingying Xu, Leonel Arana, Nachiket R. Raravikar, Rajasekaran Swaminathan, Rahul N. Manepalli 2013-10-29 $22,754,000
8466559 Forming die backside coating structures with coreless packages Rahul N. Manepalli, Dingying Xu, Javier Soto Gonzalez, Edward R. Prack 2013-06-18 $21,688,000
8304065 Treatment for a microelectronic device and method of resisting damage to a microelectronic device using same Leonel Arana, Dingying Xu, Vijay Wakharkar, Wen Feng, Nirupama Chakrapani +2 more 2012-11-06
8287996 Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die Dingying Xu, Leonel Arana, Nachiket R. Raravikar, Rajasekaran Swaminathan, Rahul N. Manepalli 2012-10-16 $11,593,000
8227551 Polymeric compositions, methods of manufacture thereof and articles comprising the same Alan J. Lesser, Naveen Singh 2012-07-24