Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11340258 | Probe pins with etched tips for electrical die test | Joseph D. Stanford, David Craig, Todd P. Albertson, Dingying Xu | 2022-05-24 |
| 10998275 | Package with cathodic protection for corrosion mitigation | Kyle Yazzie | 2021-05-04 |
| 10957656 | Integrated circuit packages with patterned protective material | Kyle Yazzie, Naga Sivakumar Yagnamurthy, Pramod Malatkar, Chia-Pin Chiu, Mark Gallina +3 more | 2021-03-23 |
| 10598696 | Probe pins with etched tips for electrical die test | Joseph D. Stanford, David Craig, Todd P. Albertson, Dingying Xu | 2020-03-24 |
| 10499461 | Thermal head with a thermal barrier for integrated circuit die processing | Kyle Yazzie, Dingying Xu, Kuang Liu, Paul Diglio, Pramod Malatkar | 2019-12-03 |
| 9793151 | Stiffener tape for electronic assembly | Xavier Francois Brun, Arjun Krishnan, Dingying Xu | 2017-10-17 |
| 9698108 | Structures to mitigate contamination on a back side of a semiconductor substrate | Xavier Francois Brun, Shweta Agrawal, Hao Wu, Shengquan Ou, Hualiang Shi | 2017-07-04 |
| 9406618 | Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same | John S. Guzek, Ravi Kiran Nalla, Javier Solo Gonzalez, Drew W. Delaney, Suresh Pothukuchi +2 more | 2016-08-02 |
| 9165914 | Forming die backside coating structures with coreless packages | Rahul N. Manepalli, David Xu, Javier Soto Gonzalez, Edward R. Prack | 2015-10-20 |
| 8786066 | Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same | John S. Guzek, Ravi Kiran Nalla, Javier Soto Gonzalez, Drew W. Delaney, Suresh Pothukuchi +2 more | 2014-07-22 |
| 8569108 | Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die | Dingying Xu, Leonel Arana, Nachiket R. Raravikar, Rajasekaran Swaminathan, Rahul N. Manepalli | 2013-10-29 |
| 8466559 | Forming die backside coating structures with coreless packages | Rahul N. Manepalli, Dingying Xu, Javier Soto Gonzalez, Edward R. Prack | 2013-06-18 |
| 8304065 | Treatment for a microelectronic device and method of resisting damage to a microelectronic device using same | Leonel Arana, Dingying Xu, Vijay Wakharkar, Wen Feng, Nirupama Chakrapani +2 more | 2012-11-06 |
| 8287996 | Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die | Dingying Xu, Leonel Arana, Nachiket R. Raravikar, Rajasekaran Swaminathan, Rahul N. Manepalli | 2012-10-16 |
| 8227551 | Polymeric compositions, methods of manufacture thereof and articles comprising the same | Alan J. Lesser, Naveen Singh | 2012-07-24 |