| 11340258 |
Probe pins with etched tips for electrical die test |
Joseph D. Stanford, David Craig, Todd P. Albertson, Dingying Xu |
2022-05-24 |
| 10998275 |
Package with cathodic protection for corrosion mitigation |
Kyle Yazzie |
2021-05-04 |
| 10957656 |
Integrated circuit packages with patterned protective material |
Kyle Yazzie, Naga Sivakumar Yagnamurthy, Pramod Malatkar, Chia-Pin Chiu, Mark Gallina +3 more |
2021-03-23 |
| 10598696 |
Probe pins with etched tips for electrical die test |
Joseph D. Stanford, David Craig, Todd P. Albertson, Dingying Xu |
2020-03-24 |
| 10499461 |
Thermal head with a thermal barrier for integrated circuit die processing |
Kyle Yazzie, Dingying Xu, Kuang Liu, Paul Diglio, Pramod Malatkar |
2019-12-03 |
| 9793151 |
Stiffener tape for electronic assembly |
Xavier Francois Brun, Arjun Krishnan, Dingying Xu |
2017-10-17 |
| 9698108 |
Structures to mitigate contamination on a back side of a semiconductor substrate |
Xavier Francois Brun, Shweta Agrawal, Hao Wu, Shengquan Ou, Hualiang Shi |
2017-07-04 |
| 9406618 |
Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same |
John S. Guzek, Ravi Kiran Nalla, Javier Solo Gonzalez, Drew W. Delaney, Suresh Pothukuchi +2 more |
2016-08-02 |
| 9165914 |
Forming die backside coating structures with coreless packages |
Rahul N. Manepalli, David Xu, Javier Soto Gonzalez, Edward R. Prack |
2015-10-20 |
| 8786066 |
Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same |
John S. Guzek, Ravi Kiran Nalla, Javier Soto Gonzalez, Drew W. Delaney, Suresh Pothukuchi +2 more |
2014-07-22 |
| 8569108 |
Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die |
Dingying Xu, Leonel Arana, Nachiket R. Raravikar, Rajasekaran Swaminathan, Rahul N. Manepalli |
2013-10-29 |
| 8466559 |
Forming die backside coating structures with coreless packages |
Rahul N. Manepalli, Dingying Xu, Javier Soto Gonzalez, Edward R. Prack |
2013-06-18 |
| 8304065 |
Treatment for a microelectronic device and method of resisting damage to a microelectronic device using same |
Leonel Arana, Dingying Xu, Vijay Wakharkar, Wen Feng, Nirupama Chakrapani +2 more |
2012-11-06 |
| 8287996 |
Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die |
Dingying Xu, Leonel Arana, Nachiket R. Raravikar, Rajasekaran Swaminathan, Rahul N. Manepalli |
2012-10-16 |
| 8227551 |
Polymeric compositions, methods of manufacture thereof and articles comprising the same |
Alan J. Lesser, Naveen Singh |
2012-07-24 |