Issued Patents All Time
Showing 25 most recent of 83 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12230582 | Embedded die on interposer packages | — | 2025-02-18 |
| 12107042 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan | 2024-10-01 |
| 11984396 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan | 2024-05-14 |
| 11798892 | Embedded die on interposer packages | — | 2023-10-24 |
| 11515248 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan | 2022-11-29 |
| 11257688 | Embedded semiconductive chips in reconstituted wafers, and systems containing same | Robert L. Sankman | 2022-02-22 |
| 11201128 | Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packages | Pramod Malatkar, Weng Hong Teh, Robert L. Sankman | 2021-12-14 |
| 10930596 | Embedded die on interposer packages | — | 2021-02-23 |
| 10796988 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan | 2020-10-06 |
| 10651051 | Embedded semiconductive chips in reconstituted wafers, and systems containing same | Robert L. Sankman | 2020-05-12 |
| 10636769 | Semiconductor package having spacer layer | Weng Hong Teh, Shan Zhong | 2020-04-28 |
| 10595409 | Electro-magnetic interference (EMI) shielding techniques and configurations | Adel A. Elsherbini, Ravindranath V. Mahajan, Nitin A. Deshpande | 2020-03-17 |
| 10541232 | Recessed and embedded die coreless package | — | 2020-01-21 |
| 10453799 | Logic die and other components embedded in build-up layers | Deepak Kulkarni, Russell K. Mortensen | 2019-10-22 |
| 10366951 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, Chia-Pin Chiu, Deepak Kulkarni, Ravindranath V. Mahajan | 2019-07-30 |
| 10170409 | Package on package architecture and method for making | Sanka Ganesan, Nitesh Nimkar, Klaus Reingruber, Thorsten Meyer | 2019-01-01 |
| 10163863 | Recessed and embedded die coreless package | — | 2018-12-25 |
| 10083936 | Semiconductor package having spacer layer | Weng Hong Teh, Shan Zhong | 2018-09-25 |
| 10008452 | Microelectronic structures having laminated or embedded glass routing structures for high density packaging | Qing Ma, Johanna M. Swan, Robert Starkston, Robert L. Sankman, Aleksandar Aleksov | 2018-06-26 |
| 9999129 | Microelectronic device and method of manufacturing same | Mihir K. Roy, Brent M. Roberts | 2018-06-12 |
| 9941245 | Integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate | Oswald Skeete, Ravi Mahajan | 2018-04-10 |
| 9871026 | Embedded memory and power management subpackage | Debendra Mallik, Sasha N. Oster, Timothy McIntosh | 2018-01-16 |
| 9859253 | Integrated circuit package stack | Saikumar Jayaraman, Yidnekachew S. Mekonnen | 2018-01-02 |
| 9847234 | Embedded semiconductive chips in reconstituted wafers, and systems containing same | Robert L. Sankman | 2017-12-19 |
| 9842832 | High density interconnection of microelectronic devices | Omkar G. Karhade, Johanna M. Swan, Christopher J. Nelson, Nitin A. Deshpande, William J. Lambert +6 more | 2017-12-12 |