| 12230582 |
Embedded die on interposer packages |
— |
2025-02-18 |
|
| 12107042 |
Localized high density substrate routing |
Robert Starkston, Debendra Mallik, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan |
2024-10-01 |
$20,560,000 |
| 11984396 |
Localized high density substrate routing |
Robert Starkston, Debendra Mallik, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan |
2024-05-14 |
$33,809,000 |
| 11798892 |
Embedded die on interposer packages |
— |
2023-10-24 |
$20,059,000 |
| 11515248 |
Localized high density substrate routing |
Robert Starkston, Debendra Mallik, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan |
2022-11-29 |
$14,086,000 |
| 11257688 |
Embedded semiconductive chips in reconstituted wafers, and systems containing same |
Robert L. Sankman |
2022-02-22 |
$16,582,000 |
| 11201128 |
Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packages |
Pramod Malatkar, Weng Hong Teh, Robert L. Sankman |
2021-12-14 |
$41,312,000 |
| 10930596 |
Embedded die on interposer packages |
— |
2021-02-23 |
$31,062,000 |
| 10796988 |
Localized high density substrate routing |
Robert Starkston, Debendra Mallik, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan |
2020-10-06 |
$29,609,000 |
| 10651051 |
Embedded semiconductive chips in reconstituted wafers, and systems containing same |
Robert L. Sankman |
2020-05-12 |
$29,489,000 |
| 10636769 |
Semiconductor package having spacer layer |
Weng Hong Teh, Shan Zhong |
2020-04-28 |
$36,717,000 |
| 10595409 |
Electro-magnetic interference (EMI) shielding techniques and configurations |
Adel A. Elsherbini, Ravindranath V. Mahajan, Nitin A. Deshpande |
2020-03-17 |
$21,927,000 |
| 10541232 |
Recessed and embedded die coreless package |
— |
2020-01-21 |
$31,546,000 |
| 10453799 |
Logic die and other components embedded in build-up layers |
Deepak Kulkarni, Russell K. Mortensen |
2019-10-22 |
$16,310,000 |
| 10366951 |
Localized high density substrate routing |
Robert Starkston, Debendra Mallik, Chia-Pin Chiu, Deepak Kulkarni, Ravindranath V. Mahajan |
2019-07-30 |
$29,864,000 |
| 10170409 |
Package on package architecture and method for making |
Sanka Ganesan, Nitesh Nimkar, Klaus Reingruber, Thorsten Meyer |
2019-01-01 |
|
| 10163863 |
Recessed and embedded die coreless package |
— |
2018-12-25 |
|
| 10083936 |
Semiconductor package having spacer layer |
Weng Hong Teh, Shan Zhong |
2018-09-25 |
$26,257,000 |
| 10008452 |
Microelectronic structures having laminated or embedded glass routing structures for high density packaging |
Qing Ma, Johanna M. Swan, Robert Starkston, Robert L. Sankman, Aleksandar Aleksov |
2018-06-26 |
$24,418,000 |
| 9999129 |
Microelectronic device and method of manufacturing same |
Mihir K. Roy, Brent M. Roberts |
2018-06-12 |
$21,622,000 |
| 9941245 |
Integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate |
Oswald Skeete, Ravi Mahajan |
2018-04-10 |
$20,820,000 |
| 9871026 |
Embedded memory and power management subpackage |
Debendra Mallik, Sasha N. Oster, Timothy McIntosh |
2018-01-16 |
$17,139,000 |
| 9859253 |
Integrated circuit package stack |
Saikumar Jayaraman, Yidnekachew S. Mekonnen |
2018-01-02 |
$11,729,000 |
| 9847234 |
Embedded semiconductive chips in reconstituted wafers, and systems containing same |
Robert L. Sankman |
2017-12-19 |
$19,551,000 |
| 9842832 |
High density interconnection of microelectronic devices |
Omkar G. Karhade, Johanna M. Swan, Christopher J. Nelson, Nitin A. Deshpande, William J. Lambert +6 more |
2017-12-12 |
$18,742,000 |
