| 12334413 |
System in package with flip chip die over multi-layer heatsink stanchion |
Kelly M. Lear, Jeffrey Miller, Christine Blair |
2025-06-17 |
|
| 12094831 |
High density interconnect device and method |
Mathew J. Manusharow |
2024-09-17 |
|
| 12087656 |
Package architecture utilizing wafer to wafer bonding |
Anthony M. Chiu, Robert Charles Dry |
2024-09-10 |
$23,279,000 |
| 12002762 |
High density organic bridge device and method |
Stefanie M. Lotz, Wei-Lun Kane Jen |
2024-06-04 |
$24,500,000 |
| 11942391 |
System in package with flip chip die over multi-layer heatsink stanchion |
Kelly M. Lear, Jeffrey Miller, Christine Blair |
2024-03-26 |
$16,276,000 |
| 11664320 |
High density interconnect device and method |
Mathew J. Manusharow |
2023-05-30 |
|
| 11637050 |
Package architecture utilizing wafer to wafer bonding |
Anthony M. Chiu, Robert Charles Dry |
2023-04-25 |
$63,082,000 |
| 11608564 |
Helical plated through-hole package inductor |
William J. Lambert, Mathew J. Manusharow, Yikang Deng |
2023-03-21 |
$20,076,000 |
| 11443970 |
Methods of forming a package substrate |
Manohar S. Konchady, Tao Wu, Wei-Lun Kane Jen, Yi Li |
2022-09-13 |
$14,653,000 |
| 11158578 |
High density interconnect device and method |
Mathew J. Manusharow |
2021-10-26 |
$21,268,000 |
| 10998120 |
Method of making an inductor |
William J. Lambert, Mathew J. Manusharow, Yikang Deng |
2021-05-04 |
$37,420,000 |
| 10971416 |
Package power delivery using plane and shaped vias |
Krishna Bharath, Mathew J. Manusharow, Adel A. Elsherbini, Aleksandar Aleksov, Yidnekachew S. Mekonnen +4 more |
2021-04-06 |
$36,336,000 |
| 10734282 |
Substrate conductor structure and method |
Harold Ryan Chase, Mathew J. Manusharow, Mark S. Hlad |
2020-08-04 |
$32,661,000 |
| 10672713 |
High density organic bridge device and method |
Stefanie M. Lotz, Wei-Lun Kane Jen |
2020-06-02 |
$32,838,000 |
| 10629469 |
Solder resist layers for coreless packages and methods of fabrication |
Manohar S. Konchady, Tao Wu, Wei-Lun Kane Jen, Yi Li |
2020-04-21 |
$45,742,000 |
| 10446499 |
High density interconnect device and method |
Mathew J. Manusharow |
2019-10-15 |
$18,012,000 |
| 10410939 |
Package power delivery using plane and shaped vias |
Krishna Bharath, Mathew J. Manusharow, Adel A. Elsherbini, Aleksandar Aleksov, Yidnekachew S. Mekonnen +4 more |
2019-09-10 |
$24,704,000 |
| 10312007 |
Inductor formed in substrate |
Mathew J. Manusharow, Harold Ryan Chase |
2019-06-04 |
$21,702,000 |
| 10163557 |
Helical plated through-hole package inductor |
William J. Lambert, Mathew J. Manusharow, Yikang Deng |
2018-12-25 |
|
| 10121701 |
Substrate conductor structure and method |
Harold Ryan Chase, Mathew J. Manusharow, Mark S. Hlad |
2018-11-06 |
$18,970,000 |
| 10103105 |
High density organic bridge device and method |
Stefanie M. Lotz, Wei-Lun Kane Jen |
2018-10-16 |
$21,459,000 |
| 10085341 |
Direct chip attach using embedded traces |
Mathew J. Manusharow |
2018-09-25 |
$26,257,000 |
| 10028394 |
Electrical interconnect formed through buildup process |
Matthew J Manusharow |
2018-07-17 |
$22,904,000 |
| 9999129 |
Microelectronic device and method of manufacturing same |
John S. Guzek, Brent M. Roberts |
2018-06-12 |
$21,622,000 |
| 9917044 |
Package with bi-layered dielectric structure |
Zheng Zhou, Chong Zhang, Kyu Oh Lee, Amanda E. Schuckman |
2018-03-13 |
$24,990,000 |
