{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "High density interconnect device and method", "item": "https://www.patentleaderboard.com/patent/11158578"}]}
Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › High density interconnect device and method

High density interconnect device and method

US Patent 11158578 · Granted Oct 26, 2021

Estimated economic value: $21,268,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

System in package with flip chip die over multi-layer heatsink stanchion2025
Magnetic core inductors in interposer2025
Size and efficiency of dies2024
High density interconnect device and method2024
High density interconnect device and method2024
Package architecture utilizing wafer to wafer bonding2024
Size and efficiency of dies2024
High performance integrated RF passives using dual lithography process2024
High density organic bridge device and method2024
Size and efficiency of dies2024
System in package with flip chip die over multi-layer heatsink stanchion2024
Low loss and low cross talk transmission lines with stacked dielectric layers fo2023