Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Package architecture utilizing wafer to wafer bonding

Package architecture utilizing wafer to wafer bonding

US Patent 12087656 · Granted Sep 10, 2024

Estimated economic value: $23,279,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

System in package with flip chip die over multi-layer heatsink stanchion2025
Electronic component with lid to manage radiation feedback2025
High density interconnect device and method2024
High density organic bridge device and method2024
Electronic component with lid to manage radiation feedback2024
System in package with flip chip die over multi-layer heatsink stanchion2024
Integrated circuit die stacked with backer die including capacitors and thermal 2023
High density interconnect device and method2023
Package architecture utilizing wafer to wafer bonding2023
Package architecture utilizing wafer to wafer bonding2023
Package architecture utilizing wafer to wafer bonding2023
Helical plated through-hole package inductor2023