Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087656 | Package architecture utilizing wafer to wafer bonding | Anthony M. Chiu, Mihir K. Roy | 2024-09-10 |
| 11637050 | Package architecture utilizing wafer to wafer bonding | Anthony M. Chiu, Mihir K. Roy | 2023-04-25 |
| 11348798 | Methods of forming integrated circuit devices using cutting tools to expose metallization pads through a cap structure and related cutting devices | Brook Hosse | 2022-05-31 |
| 11244884 | Semiconductor package with floating heat spreader and process for making the same | — | 2022-02-08 |
| 11114363 | Electronic package arrangements and related methods | Deepukumar M. Nair, Jeffrey Dekosky | 2021-09-07 |
| 10872837 | Air-cavity semiconductor package with low cost high thermal carrier | Christine Blair | 2020-12-22 |
| 10855240 | Structures for spatial power-combining devices | Christo Bojkov, Dylan Murdock | 2020-12-01 |
| 10832984 | Environmental protection for wafer level and package level applications | Christo Bojkov, Andrew Arthur Ketterson | 2020-11-10 |
| 10734301 | Semiconductor package with floating heat spreader and process for making the same | — | 2020-08-04 |
| 10651103 | Environmental protection for wafer level and package level applications | Christo Bojkov, Andrew Arthur Ketterson | 2020-05-12 |
| 10199313 | Ring-frame power package | — | 2019-02-05 |
| 10008473 | Power package lid | Steve Jones, Jonathan J. Fain | 2018-06-26 |
| 9666498 | Ring-frame power package | — | 2017-05-30 |
| 9536803 | Integrated power module with improved isolation and thermal conductivity | David C. Sheridan, Don Willis | 2017-01-03 |