Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12002866 | Radio frequency devices with photo-imageable polymers and related methods | Zhi Li, Michael Roberg, Harold Isom | 2024-06-04 |
| 11929300 | Method for packaging an integrated circuit (IC) package with embedded heat spreader in a redistribution layer (RDL) | Kevin J. Anderson, Andrew Arthur Ketterson, Tarak A. Railkar, Deep C. Dumka | 2024-03-12 |
| 11877505 | Fluorinated polymers with low dielectric loss for environmental protection in semiconductor devices | Michael Roberg, Matthew Essar, Walid M. Meliane, Terry Hon | 2024-01-16 |
| 11791312 | MMICs with backside interconnects for fanout-style packaging | Andrew Arthur Ketterson | 2023-10-17 |
| 11626340 | Integrated circuit (IC) package with embedded heat spreader in a redistribution layer (RDL) | Kevin J. Anderson, Andrew Arthur Ketterson, Tarak A. Railkar, Deep C. Dumka | 2023-04-11 |
| 10855240 | Structures for spatial power-combining devices | Dylan Murdock, Robert Charles Dry | 2020-12-01 |
| 10832984 | Environmental protection for wafer level and package level applications | Andrew Arthur Ketterson, Robert Charles Dry | 2020-11-10 |
| 10651103 | Environmental protection for wafer level and package level applications | Andrew Arthur Ketterson, Robert Charles Dry | 2020-05-12 |
| 8035226 | Wafer level package integrated circuit incorporating solder balls containing an organic plastic-core | Duane Thomas Wilcoxen, Ajay Kumar Ghai, Steve Detlev Cate | 2011-10-11 |
| 7271030 | Direct bumping on integrated circuit contacts enabled by metal-to-insulator adhesion | Orlando Torres | 2007-09-18 |
| 7262126 | Sealing and protecting integrated circuit bonding pads | Michael Krumnow | 2007-08-28 |
| 7005752 | Direct bumping on integrated circuit contacts enabled by metal-to-insulator adhesion | Orlando Torres | 2006-02-28 |
| 6979647 | Method for chemical etch control of noble metals in the presence of less noble metals | Diane Arbuthnot, Robert F. Kunesh | 2005-12-27 |
| 6927493 | Sealing and protecting integrated circuit bonding pads | Michael Krumnow | 2005-08-09 |
| 6504311 | Cold-cathode cathodoluminescent lamp | Nalin Kumar, Martin A. Kykta | 2003-01-07 |
| 6084338 | Cathode assembly with diamond particles and layer | Richard Lee Fink, Nalin Kumar, Alexei Tikhonski, Zvi Yaniv | 2000-07-04 |
| 5973452 | Display | Richard Lee Fink, Nalin Kumar, Alexei Tikhonski, Zvi Yaniv | 1999-10-26 |
| 5947783 | Method of forming a cathode assembly comprising a diamond layer | Richard Lee Fink, Nalin Kumar, Alexei Tikhonski, Zvi Yaniv | 1999-09-07 |
| 5906721 | Composition and method for preparing phosphor films exhibiting decreased coulombic aging | Leif Fredin, Nalin Kumar, Howard K. Schmidt | 1999-05-25 |
| 5853554 | Composition and method for preparing phosphor films exhibiting decreased coulombic aging | Leif Fredin, Nalin Kumar, Howard K. Schmidt | 1998-12-29 |