Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12308337 | Power semiconductor apparatus and bonding method thereof | — | 2025-05-20 |
| 11251152 | Thinned semiconductor chip with edge support | Chiao-Shun Chuang, Rain Liu, Thomas R. L. Tsai, Will Zhang | 2022-02-15 |
| 9093333 | Integrated circuit device having extended under ball metallization | Yong Li Xu, Yi-Sheng Anthony Sun, Viren Khandekar, Arkadii V. Samoilov | 2015-07-28 |
| 8575493 | Integrated circuit device having extended under ball metallization | Yong Li Xu, Yi-Sheng Anthony Sun, Viren Khandekar, Arkadii V. Samoilov | 2013-11-05 |
| 8035226 | Wafer level package integrated circuit incorporating solder balls containing an organic plastic-core | Christo Bojkov, Ajay Kumar Ghai, Steve Detlev Cate | 2011-10-11 |
| 5059556 | Low stress polysilicon microstructures | — | 1991-10-22 |