Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11009256 | Crack-resistant polymer foam ducts and method of installing same | John Steve Mills, Creed Ernest Blevins, Luisa F. Gutierrez, Charles Douglas Hall | 2021-05-18 |
| 10274116 | Environmental conditioning systems and methods utilizing polyvinylidene fluoride (PVDF) foam ducts | Federico Merheb, Nicholas W. Newell, Donald C. Barnes | 2019-04-30 |
| 7271030 | Direct bumping on integrated circuit contacts enabled by metal-to-insulator adhesion | Christo Bojkov | 2007-09-18 |
| 7005752 | Direct bumping on integrated circuit contacts enabled by metal-to-insulator adhesion | Christo Bojkov | 2006-02-28 |
| 6657311 | Heat dissipating flip-chip ball grid array | Edgardo Hortaleza | 2003-12-02 |
| 5960262 | Stitch bond enhancement for hard-to-bond materials | Edgardo Hortaleza | 1999-09-28 |