Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7476597 | Methods and systems for laser assisted wirebonding | Willmar Subido, Stuart M. Jacobsen | 2009-01-13 |
| 7351651 | Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuits | Lei Li | 2008-04-01 |
| 7061114 | Structure and method for contact pads having a protected bondable metal plug over copper-metallized integrated circuits | Lei Li | 2006-06-13 |
| 6686291 | Undercut process with isotropic plasma etching at package level | — | 2004-02-03 |
| 6657311 | Heat dissipating flip-chip ball grid array | Orlando Torres | 2003-12-02 |
| 6182882 | Angled transducer-dual head bonder for optimum ultrasonic power application and flexibility for tight pitch leadframe | Willmar Subido | 2001-02-06 |
| 6131792 | Balancing of x and y axis bonding by 45 degree capillary positioning | Willmar Subido | 2000-10-17 |
| 6112973 | Angled transducer-dual head bonder for optimum ultrasonic power application and flexibility for tight pitch leadframe | Willmar Subido | 2000-09-05 |
| 6089443 | Balancing of x and y axis bonding by 45 degree capillary positioning | Willmar Subido | 2000-07-18 |
| 5984162 | Room temperature ball bonding | Timothy J. Hogan | 1999-11-16 |
| 5960262 | Stitch bond enhancement for hard-to-bond materials | Orlando Torres | 1999-09-28 |