Issued Patents All Time
Showing 25 most recent of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12091311 | Wafer level packaging of MEMS | Wei-Yan Shih | 2024-09-17 |
| 11799436 | Method of forming an integrated resonator with a mass bias | Byron Neville Burgess, William R. Krenik | 2023-10-24 |
| 11498831 | Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip | Kurt Peter Wachtler, Makoto Yoshino, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse +2 more | 2022-11-15 |
| 10723616 | Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip | Kurt Peter Wachtler, Makoto Yoshino, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse +2 more | 2020-07-28 |
| 10396746 | Method of forming an integrated resonator with a mass bias | Byron Neville Burgess, William R. Krenik | 2019-08-27 |
| 10233074 | Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip | Kurt Peter Wachtler, Makoto Yoshino, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse +2 more | 2019-03-19 |
| 10009008 | Bulk acoustic wave (BAW) device having roughened bottom side | Brian E. Goodlin | 2018-06-26 |
| 9929714 | Temperature compensated bulk acoustic wave resonator with a high coupling coefficient | Rick L. Wise, Maria Wang, Ricky Alan Jackson, Nicholas Stephen Dellas, Django Trombley | 2018-03-27 |
| 9910015 | Sensor array chip with piezoelectric transducer including inkjet forming method | — | 2018-03-06 |
| 9896330 | Structure and method for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip | Kurt Peter Wachtler, Makoto Yoshino, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse +2 more | 2018-02-20 |
| 9630835 | Wafer level packaging of MEMS | Wei-Yan Shih | 2017-04-25 |
| 9503047 | Bulk acoustic wave (BAW) device having roughened bottom side | Brian E. Goodlin | 2016-11-22 |
| 9305971 | Integrated piezoelectric resonator and additional active circuit | Sridhar Ramaswamy, William R. Krenik | 2016-04-05 |
| 9246467 | Integrated resonator with a mass bias | Byron Neville Burgess, William R. Krenik | 2016-01-26 |
| 9240767 | Temperature-controlled integrated piezoelectric resonator apparatus | Byron Neville Burgess, William R. Krenik | 2016-01-19 |
| 9129886 | Integrated piezoelectric resonator and additional active circuit | Sridhar Ramaswamy, William R. Krenik | 2015-09-08 |
| 8968527 | Micro-fluid ejection devices, methods for making micro-fluid ejection heads, and micro-fluid ejection head having high resistance thin film heaters | Yimin Guan, Carl Edmond Sullivan | 2015-03-03 |
| 8409458 | Process for reactive ion etching a layer of diamond like carbon | Erika Leigh Shoemaker, Maria Wang, Mary Alyssa Drummond Roby | 2013-04-02 |
| 8288243 | Method for fabricating through substrate microchannels | Byron Neville Burgess | 2012-10-16 |
| 7883822 | Graded lithographic mask | Byron Neville Burgess | 2011-02-08 |
| 7795070 | Semiconductor device including an amorphous nitrided silicon adhesion layer and method of manufacture therefor | Maria Wang, Erika Leigh Shoemaker, Mary Alyssa Drummond Roby | 2010-09-14 |
| 7673972 | Micro-fluid ejection devices, methods for making micro-fluid ejection heads, and micro-fluid ejection head having high resistance thin film heaters | Yimin Guan, Carl Edmond Sullivan | 2010-03-09 |
| 7476597 | Methods and systems for laser assisted wirebonding | Willmar Subido, Edgardo Hortaleza | 2009-01-13 |
| 7463118 | Piezoelectric resonator with an efficient all-dielectric Bragg reflector | — | 2008-12-09 |
| 7401875 | Inkjet printhead incorporating a memory array | Mary Alyssa Drummond Roby, Erika Leigh Shoemaker, Maria Wang | 2008-07-22 |