| 12091311 |
Wafer level packaging of MEMS |
Wei-Yan Shih |
2024-09-17 |
$65,071,000 |
| 11799436 |
Method of forming an integrated resonator with a mass bias |
Byron Neville Burgess, William R. Krenik |
2023-10-24 |
$22,019,000 |
| 11498831 |
Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip |
Kurt Peter Wachtler, Makoto Yoshino, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse +2 more |
2022-11-15 |
$32,519,000 |
| 10723616 |
Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip |
Kurt Peter Wachtler, Makoto Yoshino, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse +2 more |
2020-07-28 |
$26,870,000 |
| 10396746 |
Method of forming an integrated resonator with a mass bias |
Byron Neville Burgess, William R. Krenik |
2019-08-27 |
$25,477,000 |
| 10233074 |
Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip |
Kurt Peter Wachtler, Makoto Yoshino, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse +2 more |
2019-03-19 |
$55,906,000 |
| 10009008 |
Bulk acoustic wave (BAW) device having roughened bottom side |
Brian E. Goodlin |
2018-06-26 |
$22,591,000 |
| 9929714 |
Temperature compensated bulk acoustic wave resonator with a high coupling coefficient |
Rick L. Wise, Maria Wang, Ricky Alan Jackson, Nicholas Stephen Dellas, Django Trombley |
2018-03-27 |
$33,589,000 |
| 9910015 |
Sensor array chip with piezoelectric transducer including inkjet forming method |
— |
2018-03-06 |
$60,797,000 |
| 9896330 |
Structure and method for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip |
Kurt Peter Wachtler, Makoto Yoshino, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse +2 more |
2018-02-20 |
$23,006,000 |
| 9630835 |
Wafer level packaging of MEMS |
Wei-Yan Shih |
2017-04-25 |
$12,851,000 |
| 9503047 |
Bulk acoustic wave (BAW) device having roughened bottom side |
Brian E. Goodlin |
2016-11-22 |
$13,857,000 |
| 9305971 |
Integrated piezoelectric resonator and additional active circuit |
Sridhar Ramaswamy, William R. Krenik |
2016-04-05 |
$12,005,000 |
| 9246467 |
Integrated resonator with a mass bias |
Byron Neville Burgess, William R. Krenik |
2016-01-26 |
$10,949,000 |
| 9240767 |
Temperature-controlled integrated piezoelectric resonator apparatus |
Byron Neville Burgess, William R. Krenik |
2016-01-19 |
$12,158,000 |
| 9129886 |
Integrated piezoelectric resonator and additional active circuit |
Sridhar Ramaswamy, William R. Krenik |
2015-09-08 |
$8,388,000 |
| 8968527 |
Micro-fluid ejection devices, methods for making micro-fluid ejection heads, and micro-fluid ejection head having high resistance thin film heaters |
Yimin Guan, Carl Edmond Sullivan |
2015-03-03 |
|
| 8409458 |
Process for reactive ion etching a layer of diamond like carbon |
Erika Leigh Shoemaker, Maria Wang, Mary Alyssa Drummond Roby |
2013-04-02 |
$8,636,000 |
| 8288243 |
Method for fabricating through substrate microchannels |
Byron Neville Burgess |
2012-10-16 |
$6,135,000 |
| 7883822 |
Graded lithographic mask |
Byron Neville Burgess |
2011-02-08 |
$6,207,000 |
| 7795070 |
Semiconductor device including an amorphous nitrided silicon adhesion layer and method of manufacture therefor |
Maria Wang, Erika Leigh Shoemaker, Mary Alyssa Drummond Roby |
2010-09-14 |
$5,425,000 |
| 7673972 |
Micro-fluid ejection devices, methods for making micro-fluid ejection heads, and micro-fluid ejection head having high resistance thin film heaters |
Yimin Guan, Carl Edmond Sullivan |
2010-03-09 |
$2,643,000 |
| 7476597 |
Methods and systems for laser assisted wirebonding |
Willmar Subido, Edgardo Hortaleza |
2009-01-13 |
$9,458,000 |
| 7463118 |
Piezoelectric resonator with an efficient all-dielectric Bragg reflector |
— |
2008-12-09 |
$8,807,000 |
| 7401875 |
Inkjet printhead incorporating a memory array |
Mary Alyssa Drummond Roby, Erika Leigh Shoemaker, Maria Wang |
2008-07-22 |
$4,786,000 |