Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wafer level packaging of MEMS

Wafer level packaging of MEMS

US Patent 9630835 · Granted Apr 25, 2017

Estimated economic value: $12,851,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Wafer level packaging of MEMS2024
Wafer level packaging of MEMS2024
Piezo-electric sensor reset2024
Method of forming an integrated resonator with a mass bias2023
Piezoelectric thin-film sensor and use thereof2023
Structures for packaging stress-sensitive micro-electro-mechanical system stacke2022
Piezoelectric sensor apparatus2022
Differential sensor using thin-film piezoelectric capacitors2022
Piezoelectric thin-film sensor and use thereof2021
Piezo-electric sensor reset2021
Piezoelectric sensing apparatus and method2020
Structures for packaging stress-sensitive micro-electro-mechanical system stacke2020