Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12255153 | Wire bond wires for interference shielding | Abiola Awujoola, Zhuowen Sun, Wael Zohni, Ashok S. Prabhu | 2025-03-18 |
| 11810867 | Wire bond wires for interference shielding | Abiola Awujoola, Zhuowen Sun, Wael Zohni, Ashok S. Prabhu | 2023-11-07 |
| 11462483 | Wire bond wires for interference shielding | Abiola Awujoola, Zhuowen Sun, Wael Zohni, Ashok S. Prabhu | 2022-10-04 |
| 10559537 | Wire bond wires for interference shielding | Abiola Awujoola, Zhuowen Sun, Wael Zohni, Ashok S. Prabhu | 2020-02-11 |
| 10490528 | Embedded wire bond wires | Ashok S. Prabhu, Abiola Awujoola, Wael Zohni | 2019-11-26 |
| 10115678 | Wire bond wires for interference shielding | Abiola Awujoola, Zhuowen Sun, Wael Zohni, Ashok S. Prabhu | 2018-10-30 |
| 10008469 | Wafer-level packaging using wire bond wires in place of a redistribution layer | Rajesh Katkar, Tu Tam Vu, Bongsub Lee, Kyong-Mo Bang, Xuan Li +4 more | 2018-06-26 |
| 9812402 | Wire bond wires for interference shielding | Abiola Awujoola, Zhuowen Sun, Wael Zohni, Ashok S. Prabhu | 2017-11-07 |
| 9761554 | Ball bonding metal wire bond wires to metal pads | Reynaldo Co, Wael Zohni, Ashok S. Prabhu | 2017-09-12 |
| 9530749 | Coupling of side surface contacts to a circuit platform | Reynaldo Co, Hoang Linh Nguyen, Marjorie Cara, Wael Zohni, Christopher W. Lattin | 2016-12-27 |
| 9502372 | Wafer-level packaging using wire bond wires in place of a redistribution layer | Rajesh Katkar, Tu Tam Vu, Bongsub Lee, Kyong-Mo Bang, Xuan Li +4 more | 2016-11-22 |
| 9490222 | Wire bond wires for interference shielding | Abiola Awujoola, Zhuowen Sun, Wael Zohni, Ashok S. Prabhu | 2016-11-08 |
| 7476597 | Methods and systems for laser assisted wirebonding | Edgardo Hortaleza, Stuart M. Jacobsen | 2009-01-13 |
| 6855578 | Vibration-assisted method for underfilling flip-chip electronic devices | Charles Odegard | 2005-02-15 |
| 6800555 | Wire bonding process for copper-metallized integrated circuits | Howard R. Test, Gonzalo Amador | 2004-10-05 |
| 6521479 | Repackaging semiconductor IC devices for failure analysis | Ray D. Harrison, Jianbai Zhu, Kendall S. Wills | 2003-02-18 |
| 6329722 | Bonding pads for integrated circuits having copper interconnect metallization | Wei-Yan Shih, Arthur M. Wilson | 2001-12-11 |
| 6268662 | Wire bonded flip-chip assembly of semiconductor devices | Howard R. Test, Wei-Yan Shih | 2001-07-31 |
| 6182882 | Angled transducer-dual head bonder for optimum ultrasonic power application and flexibility for tight pitch leadframe | Edgardo Hortaleza | 2001-02-06 |
| 6131792 | Balancing of x and y axis bonding by 45 degree capillary positioning | Edgardo Hortaleza | 2000-10-17 |
| 6112973 | Angled transducer-dual head bonder for optimum ultrasonic power application and flexibility for tight pitch leadframe | Edgardo Hortaleza | 2000-09-05 |
| 6089443 | Balancing of x and y axis bonding by 45 degree capillary positioning | Edgardo Hortaleza | 2000-07-18 |