| 12255153 |
Wire bond wires for interference shielding |
Abiola Awujoola, Zhuowen Sun, Wael Zohni, Ashok S. Prabhu |
2025-03-18 |
| 11810867 |
Wire bond wires for interference shielding |
Abiola Awujoola, Zhuowen Sun, Wael Zohni, Ashok S. Prabhu |
2023-11-07 |
| 11462483 |
Wire bond wires for interference shielding |
Abiola Awujoola, Zhuowen Sun, Wael Zohni, Ashok S. Prabhu |
2022-10-04 |
| 10559537 |
Wire bond wires for interference shielding |
Abiola Awujoola, Zhuowen Sun, Wael Zohni, Ashok S. Prabhu |
2020-02-11 |
| 10490528 |
Embedded wire bond wires |
Ashok S. Prabhu, Abiola Awujoola, Wael Zohni |
2019-11-26 |
| 10115678 |
Wire bond wires for interference shielding |
Abiola Awujoola, Zhuowen Sun, Wael Zohni, Ashok S. Prabhu |
2018-10-30 |
| 10008469 |
Wafer-level packaging using wire bond wires in place of a redistribution layer |
Rajesh Katkar, Tu Tam Vu, Bongsub Lee, Kyong-Mo Bang, Xuan Li +4 more |
2018-06-26 |
| 9812402 |
Wire bond wires for interference shielding |
Abiola Awujoola, Zhuowen Sun, Wael Zohni, Ashok S. Prabhu |
2017-11-07 |
| 9761554 |
Ball bonding metal wire bond wires to metal pads |
Reynaldo Co, Wael Zohni, Ashok S. Prabhu |
2017-09-12 |
| 9530749 |
Coupling of side surface contacts to a circuit platform |
Reynaldo Co, Hoang Linh Nguyen, Marjorie Cara, Wael Zohni, Christopher W. Lattin |
2016-12-27 |
| 9502372 |
Wafer-level packaging using wire bond wires in place of a redistribution layer |
Rajesh Katkar, Tu Tam Vu, Bongsub Lee, Kyong-Mo Bang, Xuan Li +4 more |
2016-11-22 |
| 9490222 |
Wire bond wires for interference shielding |
Abiola Awujoola, Zhuowen Sun, Wael Zohni, Ashok S. Prabhu |
2016-11-08 |
| 7476597 |
Methods and systems for laser assisted wirebonding |
Edgardo Hortaleza, Stuart M. Jacobsen |
2009-01-13 |
| 6855578 |
Vibration-assisted method for underfilling flip-chip electronic devices |
Charles Odegard |
2005-02-15 |
| 6800555 |
Wire bonding process for copper-metallized integrated circuits |
Howard R. Test, Gonzalo Amador |
2004-10-05 |
| 6521479 |
Repackaging semiconductor IC devices for failure analysis |
Ray D. Harrison, Jianbai Zhu, Kendall S. Wills |
2003-02-18 |
| 6329722 |
Bonding pads for integrated circuits having copper interconnect metallization |
Wei-Yan Shih, Arthur M. Wilson |
2001-12-11 |
| 6268662 |
Wire bonded flip-chip assembly of semiconductor devices |
Howard R. Test, Wei-Yan Shih |
2001-07-31 |
| 6182882 |
Angled transducer-dual head bonder for optimum ultrasonic power application and flexibility for tight pitch leadframe |
Edgardo Hortaleza |
2001-02-06 |
| 6131792 |
Balancing of x and y axis bonding by 45 degree capillary positioning |
Edgardo Hortaleza |
2000-10-17 |
| 6112973 |
Angled transducer-dual head bonder for optimum ultrasonic power application and flexibility for tight pitch leadframe |
Edgardo Hortaleza |
2000-09-05 |
| 6089443 |
Balancing of x and y axis bonding by 45 degree capillary positioning |
Edgardo Hortaleza |
2000-07-18 |