AW

Arthur M. Wilson

TI Texas Instruments: 15 patents #889 of 12,488Top 8%
Overall (All Time): #328,088 of 4,157,543Top 8%
15
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
6329722 Bonding pads for integrated circuits having copper interconnect metallization Wei-Yan Shih, Willmar Subido 2001-12-11
6251789 Selective slurries for the formation of conductive structures Jody D. Larsen 2001-06-26
5944975 Method of forming a lift-off layer having controlled adhesion strength Chi-Cheong Shen, Saroja Ramamurthi 1999-08-31
5672933 Column-to-column isolation in fed display Robert H. Taylor, Chi-Cheong Shen 1997-09-30
5646068 Solder bump transfer for microelectronics packaging and assembly Mark A. Kressley, Dean L. Frew, Juanita G. Miller, John E. Hanicak, Philip Hecker +1 more 1997-07-08
5557159 Field emission microtip clusters adjacent stripe conductors Robert H. Taylor, Kenneth G. Vickers, Bruce E. Gnade, Charies E. Primm 1996-09-17
5556316 Clustered field emission microtips adjacent stripe conductors Robert H. Taylor, Kenneth G. Vickers, Bruce E. Gnade, Charles E. Primm 1996-09-17
5536993 Clustered field emission microtips adjacent stripe conductors Robert H. Taylor, Kenneth G. Vickers, Bruce E. Gnade, Charles E. Primm 1996-07-16
5327327 Three dimensional assembly of integrated circuit chips Dean L. Frew, Mark A. Kressley, Juanita G. Miller, Philip Hecker, James Drumm +2 more 1994-07-05
5225037 Method for fabrication of probe card for testing of semiconductor devices Richard A. Elder, Susan V. Bagen, Juanita G. Miller 1993-07-06
5123850 Non-destructive burn-in test socket for integrated circuit die Richard A. Elder, Randy Johnson, Dean L. Frew 1992-06-23
4890157 Integrated circuit product having a polyimide film interconnection structure 1989-12-26
4709468 Method for producing an integrated circuit product having a polyimide film interconnection structure 1987-12-01
4369090 Process for etching sloped vias in polyimide insulators David W. Laks, Stephen M. Davis 1983-01-18
4242698 Maximum density interconnections for large scale integrated circuits Prabhakar B. Ghate, Clyde R. Fuller 1980-12-30