Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5646068 | Solder bump transfer for microelectronics packaging and assembly | Arthur M. Wilson, Mark A. Kressley, Dean L. Frew, Juanita G. Miller, John E. Hanicak +1 more | 1997-07-08 |
| 5327327 | Three dimensional assembly of integrated circuit chips | Dean L. Frew, Mark A. Kressley, Arthur M. Wilson, Juanita G. Miller, James Drumm +2 more | 1994-07-05 |