JH

John E. Hanicak

TI Texas Instruments: 1 patents #7,357 of 12,488Top 60%
Overall (All Time): #3,719,659 of 4,157,543Top 90%
1
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
5646068 Solder bump transfer for microelectronics packaging and assembly Arthur M. Wilson, Mark A. Kressley, Dean L. Frew, Juanita G. Miller, Philip Hecker +1 more 1997-07-08