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Method for packaging a microelectromechanical system (MEMS) device |
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2014-01-14 |
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Ceramic header method |
Moody K. Forgey |
2010-04-06 |
| 6600183 |
Integrated circuit capacitor and memory |
Mark Visokay, Luigi Colombo, Rajesh Khamankar |
2003-07-29 |
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Integrated capacitor on the back of a chip |
Daniel Baudouin, Adin E. Hyslop, Akitoshi Nishimura, Jeffrey W. Janzen |
2002-04-16 |
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Solder bump transfer for microelectronics packaging and assembly |
Arthur M. Wilson, Dean L. Frew, Juanita G. Miller, John E. Hanicak, Philip Hecker +1 more |
1997-07-08 |
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Method for fabricating a field emission device anode plate having multiple grooves between anode conductors |
John E. Finklea, Chi-Cheong Shen, Kenneth G. Vickers |
1996-09-24 |
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Three dimensional assembly of integrated circuit chips |
Dean L. Frew, Arthur M. Wilson, Juanita G. Miller, Philip Hecker, James Drumm +2 more |
1994-07-05 |