Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8627566 | Method for packaging a microelectromechanical system (MEMS) device | Moody K. Forgey | 2014-01-14 |
| 7690106 | Ceramic header method | Moody K. Forgey | 2010-04-06 |
| 6600183 | Integrated circuit capacitor and memory | Mark Visokay, Luigi Colombo, Rajesh Khamankar | 2003-07-29 |
| 6373127 | Integrated capacitor on the back of a chip | Daniel Baudouin, Adin E. Hyslop, Akitoshi Nishimura, Jeffrey W. Janzen | 2002-04-16 |
| 5646068 | Solder bump transfer for microelectronics packaging and assembly | Arthur M. Wilson, Dean L. Frew, Juanita G. Miller, John E. Hanicak, Philip Hecker +1 more | 1997-07-08 |
| 5558554 | Method for fabricating a field emission device anode plate having multiple grooves between anode conductors | John E. Finklea, Chi-Cheong Shen, Kenneth G. Vickers | 1996-09-24 |
| 5327327 | Three dimensional assembly of integrated circuit chips | Dean L. Frew, Arthur M. Wilson, Juanita G. Miller, Philip Hecker, James Drumm +2 more | 1994-07-05 |