| 6373127 |
Integrated capacitor on the back of a chip |
Adin E. Hyslop, Akitoshi Nishimura, Jeffrey W. Janzen, Mark A. Kressley |
2002-04-16 |
| 6040983 |
Vertical passive components for surface mount assembly |
Ernest J. Russell, Jeffrey W. Janzen |
2000-03-21 |
| 5671125 |
Vertical package mounted on both sides of a printed circuit board |
Ernest J. Russell, James Wallace |
1997-09-23 |
| 5637828 |
High density semiconductor package |
Ernest J. Russell, Duy-Loan T. Le, James Wallace |
1997-06-10 |
| 5483024 |
High density semiconductor package |
Ernest J. Russell, Duy-Loan T. Le, James Wallace |
1996-01-09 |
| 5432678 |
High power dissipation vertical mounted package for surface mount application |
Ernest J. Russell, James Wallace |
1995-07-11 |
| 5414253 |
Integrated circuit card |
Alton D. Carpenter |
1995-05-09 |
| 5387814 |
Integrated circuit with supports for mounting an electrical component |
James Wallace, Ernie Russell |
1995-02-07 |
| 5352851 |
Edge-mounted, surface-mount integrated circuit device |
James Wallace, Ernie Russell |
1994-10-04 |
| 5275975 |
Method of making a relatively flat semiconductor package having a semiconductor chip encapsulated in molded material |
Ernest J. Russell |
1994-01-04 |
| 5260601 |
Edge-mounted, surface-mount package for semiconductor integrated circuit devices |
Ernest J. Russell |
1993-11-09 |
| 5208732 |
Memory card with flexible conductor between substrate and metal cover |
Alton D. Carpenter, James Wallace |
1993-05-04 |
| 4994938 |
Mounting of high density components on substrate |
— |
1991-02-19 |
| 4975763 |
Edge-mounted, surface-mount package for semiconductor integrated circuit devices |
Ernest J. Russell |
1990-12-04 |