Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6373127 | Integrated capacitor on the back of a chip | Adin E. Hyslop, Akitoshi Nishimura, Jeffrey W. Janzen, Mark A. Kressley | 2002-04-16 |
| 6040983 | Vertical passive components for surface mount assembly | Ernest J. Russell, Jeffrey W. Janzen | 2000-03-21 |
| 5671125 | Vertical package mounted on both sides of a printed circuit board | Ernest J. Russell, James Wallace | 1997-09-23 |
| 5637828 | High density semiconductor package | Ernest J. Russell, Duy-Loan T. Le, James Wallace | 1997-06-10 |
| 5483024 | High density semiconductor package | Ernest J. Russell, Duy-Loan T. Le, James Wallace | 1996-01-09 |
| 5432678 | High power dissipation vertical mounted package for surface mount application | Ernest J. Russell, James Wallace | 1995-07-11 |
| 5414253 | Integrated circuit card | Alton D. Carpenter | 1995-05-09 |
| 5387814 | Integrated circuit with supports for mounting an electrical component | James Wallace, Ernie Russell | 1995-02-07 |
| 5352851 | Edge-mounted, surface-mount integrated circuit device | James Wallace, Ernie Russell | 1994-10-04 |
| 5275975 | Method of making a relatively flat semiconductor package having a semiconductor chip encapsulated in molded material | Ernest J. Russell | 1994-01-04 |
| 5260601 | Edge-mounted, surface-mount package for semiconductor integrated circuit devices | Ernest J. Russell | 1993-11-09 |
| 5208732 | Memory card with flexible conductor between substrate and metal cover | Alton D. Carpenter, James Wallace | 1993-05-04 |
| 4994938 | Mounting of high density components on substrate | — | 1991-02-19 |
| 4975763 | Edge-mounted, surface-mount package for semiconductor integrated circuit devices | Ernest J. Russell | 1990-12-04 |