Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6784367 | Microelectronic device assemblies having a shielded input and methods for manufacturing and operating such microelectronic device assemblies | Bharath Nagabhushanam, Terry R. Lee, Roger D. Norwood | 2004-08-31 |
| 6548757 | Microelectronic device assemblies having a shielded input and methods for manufacturing and operating such microelectronic device assemblies | Bharath Nagabhushanam, Terry R. Lee, Roger D. Norwood | 2003-04-15 |
| 6465278 | Method and apparatus for delivering electrical power to a semiconductor die | — | 2002-10-15 |
| 6268643 | Lead frame device for delivering electrical power to a semiconductor die | — | 2001-07-31 |
| 6040983 | Vertical passive components for surface mount assembly | Daniel Baudouin, Jeffrey W. Janzen | 2000-03-21 |
| 5671125 | Vertical package mounted on both sides of a printed circuit board | Daniel Baudouin, James Wallace | 1997-09-23 |
| 5637828 | High density semiconductor package | Daniel Baudouin, Duy-Loan T. Le, James Wallace | 1997-06-10 |
| 5600178 | Semiconductor package having interdigitated leads | — | 1997-02-04 |
| 5589420 | Method for a hybrid leadframe-over-chip semiconductor package | — | 1996-12-31 |
| 5545920 | Leadframe-over-chip having off-chip conducting leads for increased bond pad connectivity | — | 1996-08-13 |
| 5534729 | Integrated circuit lead frame for coupling to non-neighboring bond pads | — | 1996-07-09 |
| 5521426 | Reduced capacitance lead frame for lead on chip package | — | 1996-05-28 |
| 5483024 | High density semiconductor package | Daniel Baudouin, Duy-Loan T. Le, James Wallace | 1996-01-09 |
| 5432678 | High power dissipation vertical mounted package for surface mount application | Daniel Baudouin, James Wallace | 1995-07-11 |
| 5413970 | Process for manufacturing a semiconductor package having two rows of interdigitated leads | — | 1995-05-09 |
| 5396701 | Method for packaging an integrated circuit | — | 1995-03-14 |
| 5275975 | Method of making a relatively flat semiconductor package having a semiconductor chip encapsulated in molded material | Daniel Baudouin | 1994-01-04 |
| 5260601 | Edge-mounted, surface-mount package for semiconductor integrated circuit devices | Daniel Baudouin | 1993-11-09 |
| 5231305 | Ceramic bonding bridge | — | 1993-07-27 |
| 4975763 | Edge-mounted, surface-mount package for semiconductor integrated circuit devices | Daniel Baudouin | 1990-12-04 |
| 4878920 | Process for the continuous dyeing of industrial nylon | Tanya E. FitzGerald | 1989-11-07 |
| 4832699 | Continuous process for dyeing nylon fabrics | M. K. Choi | 1989-05-23 |
| 4812140 | Continuous aqueous dyeing process for high-tenacity industrial nylon fabrics | M. K. Choi | 1989-03-14 |
| 4759770 | Process for simultaneously dyeing and improving the flame-resistant properties of aramid fibers | Barbara J. Cates, James K. Davis, Tanya E. FitzGerald | 1988-07-26 |
| 4749378 | Process for improving the flame-resistant properties of aramid fibers | Barbara J. Cates, Tanya E. FitzGerald, James K. Davis | 1988-06-07 |