Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8674504 | Wire-based methodology of widening the pitch of semiconductor chip terminals | Marvin W. Cowens, Jaimal Mallory Williamson | 2014-03-18 |
| 7598124 | System and method to increase die stand-off height | — | 2009-10-06 |
| 7550314 | Patterned plasma treatment to improve distribution of underfill material | Mohammad Yunus, Ferdinand Arabe | 2009-06-23 |
| 7445960 | Adhesion by plasma conditioning of semiconductor chip | Marvin W. Cowens, Masood Murtuza, Vinu Yamunan, Phillip R. Coffman | 2008-11-04 |
| 7393719 | Increased stand-off height integrated circuit assemblies, systems, and methods | Tz-Cheng Chiu | 2008-07-01 |
| 7323362 | Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices | Vinu Yamunan, Tz-Cheng Chiu | 2008-01-29 |
| 7319275 | Adhesion by plasma conditioning of semiconductor chip | Marvin W. Cowens, Masood Murtuza, Vinu Yamunan, Phillip R. Coffman | 2008-01-15 |
| 7276401 | Adhesion by plasma conditioning of semiconductor chip surfaces | Marvin W. Cowens, Masood Murtuza, Vinu Yamunan, Phillip R. Coffman | 2007-10-02 |
| 7271494 | Adhesion by plasma conditioning of semiconductor chip surfaces | Marvin W. Cowens, Masood Murtuza, Vinu Yamunan, Phillip R. Coffman | 2007-09-18 |
| 7224071 | System and method to increase die stand-off height | — | 2007-05-29 |
| 7045904 | Patterned plasma treatment to improve distribution of underfill material | Mohammad Yunus, Ferdinand Arabe | 2006-05-16 |
| 6977429 | Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices | Vinu Yamunan, Tz-Cheng Chiu | 2005-12-20 |
| 6869831 | Adhesion by plasma conditioning of semiconductor chip surfaces | Marvin W. Cowens, Masood Murtuza, Vinu Yamunan, Phillip R. Coffman | 2005-03-22 |
| 6855578 | Vibration-assisted method for underfilling flip-chip electronic devices | Willmar Subido | 2005-02-15 |
| 6798212 | Time domain reflectometer probe having a built-in reference ground point | Roger J. Stierman, Rebecca Holdford | 2004-09-28 |