Charles Odegard — 15 Patents at Texas Instruments

Charles Odegard has been granted 15 US patents while listed as an inventor at Texas Instruments. The first was granted in 2004 and the most recent in March 2014. Charles Odegard ranks #307,048 of 4,157,543 US inventors in our database (top 7.4%). Patent records list Charles Odegard in McKinney, TX, US.

Patents per Year

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Showing 1–15 of 15 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
8674504	Wire-based methodology of widening the pitch of semiconductor chip terminals	Marvin W. Cowens, Jaimal Mallory Williamson	2014-03-18
7598124	System and method to increase die stand-off height	—	2009-10-06	$24,920,000
7550314	Patterned plasma treatment to improve distribution of underfill material	Mohammad Yunus, Ferdinand Arabe	2009-06-23	$21,941,000
7445960	Adhesion by plasma conditioning of semiconductor chip	Marvin W. Cowens, Masood Murtuza, Vinu Yamunan, Phillip R. Coffman	2008-11-04	$19,633,000
7393719	Increased stand-off height integrated circuit assemblies, systems, and methods	Tz-Cheng Chiu	2008-07-01	$12,764,000
7323362	Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices	Vinu Yamunan, Tz-Cheng Chiu	2008-01-29	$10,343,000
7319275	Adhesion by plasma conditioning of semiconductor chip	Marvin W. Cowens, Masood Murtuza, Vinu Yamunan, Phillip R. Coffman	2008-01-15	$45,722,000
7276401	Adhesion by plasma conditioning of semiconductor chip surfaces	Marvin W. Cowens, Masood Murtuza, Vinu Yamunan, Phillip R. Coffman	2007-10-02	$14,221,000
7271494	Adhesion by plasma conditioning of semiconductor chip surfaces	Marvin W. Cowens, Masood Murtuza, Vinu Yamunan, Phillip R. Coffman	2007-09-18	$26,719,000
7224071	System and method to increase die stand-off height	—	2007-05-29	$24,325,000
7045904	Patterned plasma treatment to improve distribution of underfill material	Mohammad Yunus, Ferdinand Arabe	2006-05-16	$12,886,000
6977429	Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices	Vinu Yamunan, Tz-Cheng Chiu	2005-12-20	$24,649,000
6869831	Adhesion by plasma conditioning of semiconductor chip surfaces	Marvin W. Cowens, Masood Murtuza, Vinu Yamunan, Phillip R. Coffman	2005-03-22	$18,900,000
6855578	Vibration-assisted method for underfilling flip-chip electronic devices	Willmar Subido	2005-02-15	$15,740,000
6798212	Time domain reflectometer probe having a built-in reference ground point	Roger J. Stierman, Rebecca Holdford	2004-09-28	$12,669,000

Charles Odegard — 15 Patents

Patents per Year

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