| 7132845 |
FA tool using conductor model |
Michael A. Lamson, Jay Michael Lawyer |
2006-11-07 |
| 7071013 |
Fixture and method for uniform electroless metal deposition on integrated circuit bond pads |
Gonzalo Amador |
2006-07-04 |
| 6821791 |
Method for reworking metal layers on integrated circuit bond pads |
Thomas M. Moore, Gregory B. Shinn |
2004-11-23 |
| 6798212 |
Time domain reflectometer probe having a built-in reference ground point |
Charles Odegard, Rebecca Holdford |
2004-09-28 |
| 6534327 |
Method for reworking metal layers on integrated circuit bond pads |
Thomas M. Moore, Gregory B. Shinn |
2003-03-18 |
| 5024746 |
Fixture and a method for plating contact bumps for integrated circuits |
Robert Lessard |
1991-06-18 |
| 4979015 |
Insulated substrate for flip-chip integrated circuit device |
K. Gail Heinen, Thomas H. Ramsey, James F. Haefling |
1990-12-18 |
| 4931149 |
Fixture and a method for plating contact bumps for integrated circuits |
Robert Lessard |
1990-06-05 |
| 4874476 |
Fixture for plating tall contact bumps on integrated circuit |
Archie N. McCauley, Robert C. Zart |
1989-10-17 |
| 4861452 |
Fixture for plating tall contact bumps on integrated circuit |
Archie N. McCauley, Robert C. Zart |
1989-08-29 |
| 4691854 |
Coatings for ceramic bonding capillaries |
James F. Haefling, James W. Pritchard |
1987-09-08 |