Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE46350 | Method for stem sample inspection in a charged particle beam instrument | Lyudmila Zaykova-Feldman, Thomas M. Moore, Matthew Hammer | 2017-03-28 |
| 9349573 | Total release method for sample extraction in an energetic-beam instrument | Rocky Kruger, Cheryl Hartfield | 2016-05-24 |
| 8288740 | Method for preparing specimens for atom probe analysis and specimen assemblies made thereby | — | 2012-10-16 |
| 8247768 | Method for stem sample inspection in a charged particle beam instrument | Lyudmila Zaykova-Feldman, Thomas M. Moore, Matthew Hammer | 2012-08-21 |
| 8227781 | Variable-tilt specimen holder and method and for monitoring milling in a charged-particle instrument | Lyudmila Zaykova-Feldman, Thomas M. Moore | 2012-07-24 |
| 8168949 | Method for stem sample inspection in a charged particle beam instrument | Lyudmila Zaykova-Feldman, Thomas M. Moore, Matthew Hammer | 2012-05-01 |
| 8054558 | Multiple magnification optical system with single objective lens | Herschel M. Marchman | 2011-11-08 |
| 7935937 | Method of forming TEM sample holder | Thomas M. Moore, Lyudmila Zaykova-Feldman | 2011-05-03 |
| 7834315 | Method for STEM sample inspection in a charged particle beam instrument | Lyudmila Zaykova-Feldman, Thomas M. Moore, Matthew Hammer | 2010-11-16 |
| 7644637 | Method and apparatus for transfer of samples in a controlled environment | Thomas M. Moore | 2010-01-12 |
| 7138726 | Protective interleaf for stacked wafer shipping | Sandra Rodriguez | 2006-11-21 |
| 7071013 | Fixture and method for uniform electroless metal deposition on integrated circuit bond pads | Roger J. Stierman | 2006-07-04 |
| 6940167 | Variable cross-section plated mushroom with stud for bumping | Diane Arbuthnot | 2005-09-06 |
| 6926150 | Protective interleaf for stacked wafer shipping | Sandra Rodriguez | 2005-08-09 |
| 6800555 | Wire bonding process for copper-metallized integrated circuits | Howard R. Test, Willmar Subido | 2004-10-05 |
| 6750134 | Variable cross-section plated mushroom with stud for bumping | Diane Arbuthnot | 2004-06-15 |
| 6432744 | Wafer-scale assembly of chip-size packages | Gregory B. Hotchkiss, Katherine G. Heinen | 2002-08-13 |
| 6303407 | Method for the transfer of flux coated particles to a substrate | Gregory B. Hotchkiss | 2001-10-16 |
| 6245583 | Low stress method and apparatus of underfilling flip-chip electronic devices | Gregory B. Hotchkiss | 2001-06-12 |
| 6234296 | System for positioning a carrier relative to a travel path | Katherine G. Heinen, Jessie Buendia, Leslie Edward Stark, Chill Go | 2001-05-22 |
| 6234374 | Rapid and selective heating method in integrated circuit package assembly by means of tungsten halogen light source | Ming-Jang Hwang, Lobo Wang | 2001-05-22 |
| 6227353 | System for applying a rotary force to strips of varying widths | Katherine G. Heinen, Jessie Buendia, Leslie Edward Stark, Chill Go | 2001-05-08 |
| 6226452 | Radiant chamber for simultaneous rapid die attach and lead frame embed for ceramic packaging | Paul J. Hundt, Katherine G. Heinen, Kwan Yew Kee, Ming-Jang Hwang, Leslie Edward Stark | 2001-05-01 |
| 6069342 | Automated multiple lead frame strip radiant die attach material curing apparatus | Katherine G. Heinen, Jessie Buendia, Leslie Edward Stark, Chill Go | 2000-05-30 |
| 6041994 | Rapid and selective heating method in integrated circuit package assembly by means of tungsten halogen light source | Ming-Jang Hwang, Lobo Wang | 2000-03-28 |