| RE46350 |
Method for stem sample inspection in a charged particle beam instrument |
Lyudmila Zaykova-Feldman, Thomas M. Moore, Matthew Hammer |
2017-03-28 |
|
| 9349573 |
Total release method for sample extraction in an energetic-beam instrument |
Rocky Kruger, Cheryl Hartfield |
2016-05-24 |
|
| 8288740 |
Method for preparing specimens for atom probe analysis and specimen assemblies made thereby |
— |
2012-10-16 |
|
| 8247768 |
Method for stem sample inspection in a charged particle beam instrument |
Lyudmila Zaykova-Feldman, Thomas M. Moore, Matthew Hammer |
2012-08-21 |
|
| 8227781 |
Variable-tilt specimen holder and method and for monitoring milling in a charged-particle instrument |
Lyudmila Zaykova-Feldman, Thomas M. Moore |
2012-07-24 |
|
| 8168949 |
Method for stem sample inspection in a charged particle beam instrument |
Lyudmila Zaykova-Feldman, Thomas M. Moore, Matthew Hammer |
2012-05-01 |
|
| 8054558 |
Multiple magnification optical system with single objective lens |
Herschel M. Marchman |
2011-11-08 |
|
| 7935937 |
Method of forming TEM sample holder |
Thomas M. Moore, Lyudmila Zaykova-Feldman |
2011-05-03 |
|
| 7834315 |
Method for STEM sample inspection in a charged particle beam instrument |
Lyudmila Zaykova-Feldman, Thomas M. Moore, Matthew Hammer |
2010-11-16 |
|
| 7644637 |
Method and apparatus for transfer of samples in a controlled environment |
Thomas M. Moore |
2010-01-12 |
|
| 7138726 |
Protective interleaf for stacked wafer shipping |
Sandra Rodriguez |
2006-11-21 |
$16,782,000 |
| 7071013 |
Fixture and method for uniform electroless metal deposition on integrated circuit bond pads |
Roger J. Stierman |
2006-07-04 |
|
| 6940167 |
Variable cross-section plated mushroom with stud for bumping |
Diane Arbuthnot |
2005-09-06 |
$15,447,000 |
| 6926150 |
Protective interleaf for stacked wafer shipping |
Sandra Rodriguez |
2005-08-09 |
$19,601,000 |
| 6800555 |
Wire bonding process for copper-metallized integrated circuits |
Howard R. Test, Willmar Subido |
2004-10-05 |
$16,258,000 |
| 6750134 |
Variable cross-section plated mushroom with stud for bumping |
Diane Arbuthnot |
2004-06-15 |
$14,621,000 |
| 6432744 |
Wafer-scale assembly of chip-size packages |
Gregory B. Hotchkiss, Katherine G. Heinen |
2002-08-13 |
$19,257,000 |
| 6303407 |
Method for the transfer of flux coated particles to a substrate |
Gregory B. Hotchkiss |
2001-10-16 |
$48,999,000 |
| 6245583 |
Low stress method and apparatus of underfilling flip-chip electronic devices |
Gregory B. Hotchkiss |
2001-06-12 |
$38,888,000 |
| 6234296 |
System for positioning a carrier relative to a travel path |
Katherine G. Heinen, Jessie Buendia, Leslie Edward Stark, Chill Go |
2001-05-22 |
$60,081,000 |
| 6234374 |
Rapid and selective heating method in integrated circuit package assembly by means of tungsten halogen light source |
Ming-Jang Hwang, Lobo Wang |
2001-05-22 |
$60,081,000 |
| 6227353 |
System for applying a rotary force to strips of varying widths |
Katherine G. Heinen, Jessie Buendia, Leslie Edward Stark, Chill Go |
2001-05-08 |
$64,761,000 |
| 6226452 |
Radiant chamber for simultaneous rapid die attach and lead frame embed for ceramic packaging |
Paul J. Hundt, Katherine G. Heinen, Kwan Yew Kee, Ming-Jang Hwang, Leslie Edward Stark |
2001-05-01 |
$50,094,000 |
| 6069342 |
Automated multiple lead frame strip radiant die attach material curing apparatus |
Katherine G. Heinen, Jessie Buendia, Leslie Edward Stark, Chill Go |
2000-05-30 |
$92,682,000 |
| 6041994 |
Rapid and selective heating method in integrated circuit package assembly by means of tungsten halogen light source |
Ming-Jang Hwang, Lobo Wang |
2000-03-28 |
$191,713,000 |