Issued Patents All Time
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6730541 | Wafer-scale assembly of chip-size packages | Darvin R. Edwards, Elizabeth Jacobs | 2004-05-04 |
| 6528873 | Ball grid assembly with solder columns | — | 2003-03-04 |
| 6432744 | Wafer-scale assembly of chip-size packages | Gonzalo Amador, Gregory B. Hotchkiss | 2002-08-13 |
| 6251767 | Ball grid assembly with solder columns | — | 2001-06-26 |
| 6234296 | System for positioning a carrier relative to a travel path | Gonzalo Amador, Jessie Buendia, Leslie Edward Stark, Chill Go | 2001-05-22 |
| 6227353 | System for applying a rotary force to strips of varying widths | Gonzalo Amador, Jessie Buendia, Leslie Edward Stark, Chill Go | 2001-05-08 |
| 6226452 | Radiant chamber for simultaneous rapid die attach and lead frame embed for ceramic packaging | Paul J. Hundt, Kwan Yew Kee, Ming-Jang Hwang, Leslie Edward Stark, Gonzalo Amador | 2001-05-01 |
| 6096578 | Stress relief matrix for integrated circuit packaging | Elizabeth Jacobs | 2000-08-01 |
| 6069342 | Automated multiple lead frame strip radiant die attach material curing apparatus | Gonzalo Amador, Jessie Buendia, Leslie Edward Stark, Chill Go | 2000-05-30 |
| 6030859 | Method of making a packaged semiconductor device and a lead-frame therefor | Ichiro Anjoh, Gen Murakami, Michael A. Lamson | 2000-02-29 |
| 5993591 | Coring of leadframes in carriers via radiant heat source | Jesus S. Buendia, Gonzalo Amador, Leslie Edward Stark | 1999-11-30 |
| 5994169 | Lead frame for integrated circuits and process of packaging | Michael A. Lamson | 1999-11-30 |
| 5894173 | Stress relief matrix for integrated circuit packaging | Elizabeth Jacobs | 1999-04-13 |
| 5840599 | Process of packaging an integrated circuit with a conductive material between a lead frame and the face of the circuit | Michael A. Lamson | 1998-11-24 |
| 5650915 | Thermally enhanced molded cavity package having a parallel lid | Rafael C. Alfaro, Paul J. Hundt | 1997-07-22 |
| 5648299 | Packaged semiconductor device and a leadframe therefor | Ichiro Anjoh, Gen Murakami, Michael A. Lamson | 1997-07-15 |
| 5585665 | Packaged semiconductor device and a leadframe therefor | Ichiro Anjoh, Gen Murakami, Michael A. Lamson | 1996-12-17 |
| 5458716 | Methods for manufacturing a thermally enhanced molded cavity package having a parallel lid | Rafael C. Alfaro, Paul J. Hundt | 1995-10-17 |
| 5442233 | Packaged semiconductor device and a lead frame therefor, having a common potential lead with lead portions having dual functions of chip support and heat dissipation | Ichiro Anjoh, Gen Murakami, Michael A. Lamson | 1995-08-15 |
| 5432127 | Method for making a balanced capacitance lead frame for integrated circuits having a power bus and dummy leads | Michael A. Lamson | 1995-07-11 |
| 5422788 | Technique for enhancing adhesion capability of heat spreaders in molded packages | Brenda C. Gogue, Henry F. Breit | 1995-06-06 |
| 5418189 | Integrated circuit device and method to prevent cracking during surface mount | — | 1995-05-23 |
| 5362680 | Technique for enhancing adhesion capability of heat spreaders in molded packages | Brenda C. Gogue, Henry F. Breit | 1994-11-08 |
| 5359224 | Insulated lead frame for integrated circuits and method of manufacture thereof | Henry F. Breit | 1994-10-25 |
| 5321277 | Multi-chip module testing | Steve Sparks, Darvin R. Edwards | 1994-06-14 |