HB

Henry F. Breit

TI Texas Instruments: 19 patents #659 of 12,488Top 6%
HS H.C. Starck: 1 patents #125 of 248Top 55%
📍 Attleboro, MA: #33 of 647 inventorsTop 6%
🗺 Massachusetts: #5,623 of 88,656 inventorsTop 7%
Overall (All Time): #225,628 of 4,157,543Top 6%
20
Patents All Time

Issued Patents All Time

Showing 1–20 of 20 patents

Patent #TitleCo-InventorsDate
7416789 Refractory metal substrate with improved thermal conductivity Rong-Chein Richard Wu, Prabhat Kumar 2008-08-26
5653379 Clad metal substrate James A. Forster, Premkumar R. Hingorany 1997-08-05
5536906 Package for integrated circuits Glen R. Haas, Jr., John Barnett, Stephen R. Nelson, Douglas J. Darrow, Susan V. Bagen +1 more 1996-07-16
5435058 Hybrid/microwave enclosures and method of making same Premkumar R. Hingorany, John Austin Haug 1995-07-25
5422788 Technique for enhancing adhesion capability of heat spreaders in molded packages Katherine G. Heinen, Brenda C. Gogue 1995-06-06
5362680 Technique for enhancing adhesion capability of heat spreaders in molded packages Katherine G. Heinen, Brenda C. Gogue 1994-11-08
5359224 Insulated lead frame for integrated circuits and method of manufacture thereof Katherine G. Heinen 1994-10-25
5310520 Circuit system, a composite material for use therein, and a method of making the material Sunil Chandra Jha, James A. Forster 1994-05-10
5276423 Circuit units, substrates therefor and method of making James A. Forster 1994-01-04
5138114 Hybrid/microwave enclosures and method of making same Premkumar R. Hingorany, John Austin Haug 1992-08-11
5126511 Copper cored enclosures for hybrid circuits Robert E. Beauregard, Joseph M. Gondusky 1992-06-30
5055967 Substrate for an electrical circuit system and a circuit system using that substrate Israil M. Sukonnik, James A. Forster, Gary A. Raphanella 1991-10-08
5050040 Composite material, a heat-dissipating member using the material in a circuit system, the circuit system Joseph M. Gondusky, Karen A. Auguston 1991-09-17
5039335 Composite material for a circuit system and method of making Joseph M. Gondusky, Karen A. Auguston 1991-08-13
5036584 Method of manufacture of copper cored enclosures for hybrid circuits Robert E. Beauregard, Joseph M. Gondusky 1991-08-06
4994903 Circuit substrate and circuit using the substrate Thomas Wroe 1991-02-19
4894293 Circuit system, a composite metal material for use therein, and a method for making the material Karen A. Auguston, Joseph M. Gondusky 1990-01-16
4811166 Heat dissipating member for mounting a semiconductor device and electrical circuit unit incorporating the member Juan Martín ALVAREZ, Steven E. Levy, Premkumar R. Hingorany 1989-03-07
4598473 Process for producing reinforced structural articles and articles produced thereby 1986-07-08
4384234 Spark plug with heat conducting sleeve for center electrode 1983-05-17