Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10168863 | Component specifying and selection apparatus and method using intelligent graphic type selection interface | Jon Glidden, Ken Stull, Byran Blackham, Jason Briggs, Mark Halbur +3 more | 2019-01-01 |
| 8930821 | Component specifying and selection apparatus and method using intelligent graphic type selection interface | Byran Blackham, Jason Briggs, Jon Glidden, Mark Halbur, Leslie Hanson +3 more | 2015-01-06 |
| 6787397 | Semiconductor device protective overcoat with enhanced adhesion to polymeric materials and method of fabrication | Leland Swanson | 2004-09-07 |
| 6730541 | Wafer-scale assembly of chip-size packages | Katherine G. Heinen, Darvin R. Edwards | 2004-05-04 |
| 6580170 | Semiconductor device protective overcoat with enhanced adhesion to polymeric materials | Leland Swanson | 2003-06-17 |
| 6096578 | Stress relief matrix for integrated circuit packaging | Katherine G. Heinen | 2000-08-01 |
| 5894173 | Stress relief matrix for integrated circuit packaging | Katherine G. Heinen | 1999-04-13 |