| 12347738 |
Sensor package cavities with polymer films |
Sreenivasan K. Koduri |
2025-07-01 |
| 12203776 |
Miniature sensor cavities |
Sreenivasan K. Koduri, Christopher Daniel Manack |
2025-01-21 |
| 12198995 |
Covers for semiconductor package components |
Sreenivasan K. Koduri |
2025-01-14 |
| 11972994 |
Film covers for sensor packages |
Sreenivasan K. Koduri, Steven Kummerl, Wai Lee |
2024-04-30 |
| 11894339 |
Proximity sensor |
Sreenivasan K. Koduri |
2024-02-06 |
| 11784103 |
Covers for semiconductor package components |
Sreenivasan K. Koduri |
2023-10-10 |
| 11658083 |
Film covers for sensor packages |
Sreenivasan K. Koduri, Steven Kummerl, Wai Lee |
2023-05-23 |
| 11476175 |
Sensor package cavities with polymer films |
Sreenivasan K. Koduri |
2022-10-18 |
| 11410913 |
Multi-layer die attachment |
Mohammad Waseem Hussain, Steven Murphy |
2022-08-09 |
| 10636727 |
Multi-layer die attachment |
Mohammad Waseem Hussain, Steven Murphy |
2020-04-28 |
| 9899339 |
Discrete device mounted on substrate |
Matthew David Romig, Lance Cole Wright, Frank Stepniak, Sreenivasan K. Koduri |
2018-02-20 |
| 9111845 |
Integrated circuit package with printed circuit layer |
Matthew David Romig, Lance Cole Wright, Frank Stepniak, Sreenivasan K. Koduri |
2015-08-18 |
| 8945986 |
Electronic assembly with three dimensional inkjet printed traces |
Matthew David Romig, Lance Cole Wright, Frank Stepniak, Sreenivasan K. Koduri |
2015-02-03 |
| 8847349 |
Integrated circuit package with printed circuit layer |
Matthew David Romig, Lance Cole Wright, Frank Stepniak, Screenivasan K. Koduri |
2014-09-30 |
| 8816513 |
Electronic assembly with three dimensional inkjet printed traces |
Matthew David Romig, Lance Cole Wright, Frank Stepniak, Sreenivasan K. Koduri |
2014-08-26 |
| 6689678 |
Process for fabricating ball grid array package for enhanced stress tolerance |
Richard D. James |
2004-02-10 |
| 6583515 |
Ball grid array package for enhanced stress tolerance |
Richard D. James |
2003-06-24 |
| 6234296 |
System for positioning a carrier relative to a travel path |
Gonzalo Amador, Katherine G. Heinen, Jessie Buendia, Chill Go |
2001-05-22 |
| 6227353 |
System for applying a rotary force to strips of varying widths |
Gonzalo Amador, Katherine G. Heinen, Jessie Buendia, Chill Go |
2001-05-08 |
| 6226452 |
Radiant chamber for simultaneous rapid die attach and lead frame embed for ceramic packaging |
Paul J. Hundt, Katherine G. Heinen, Kwan Yew Kee, Ming-Jang Hwang, Gonzalo Amador |
2001-05-01 |
| 6069342 |
Automated multiple lead frame strip radiant die attach material curing apparatus |
Gonzalo Amador, Katherine G. Heinen, Jessie Buendia, Chill Go |
2000-05-30 |
| 5993591 |
Coring of leadframes in carriers via radiant heat source |
Jesus S. Buendia, Katherine G. Heinen, Gonzalo Amador |
1999-11-30 |
| 5960307 |
Method of forming ball grid array contacts |
— |
1999-09-28 |
| 5846476 |
Optical curing process for intergrated circuit package assembly |
Ming-Jang Hwang, Gail Heinen, Leo Rimpillo |
1998-12-08 |
| 5783025 |
Optical diebonding for semiconductor devices |
Ming-Jang Hwang, Gonzalo Amador |
1998-07-21 |