| 11908780 |
Semiconductor package with solder standoff |
Jonathan Almeria Noquil, Satyendra Singh Chauhan, Osvaldo Jorge Lopez |
2024-02-20 |
$42,955,000 |
| 11658130 |
Conductive plate stress reduction feature |
Tianyi Luo, Jonathan Almeria Noquil, Satyendra Singh Chauhan, Osvaldo Jorge Lopez |
2023-05-23 |
$38,750,000 |
| 11177197 |
Semiconductor package with solder standoff |
Jonathan Almeria Noquil, Satyendra Singh Chauhan, Osvaldo Jorge Lopez |
2021-11-16 |
$40,327,000 |
| 9899339 |
Discrete device mounted on substrate |
Matthew David Romig, Leslie Edward Stark, Frank Stepniak, Sreenivasan K. Koduri |
2018-02-20 |
$23,006,000 |
| 9608158 |
Proximity sensor having light-blocking structure in leadframe and method of making same |
Andy Quang Tran |
2017-03-28 |
$12,754,000 |
| 9515059 |
Proximity sensor having light-blocking structure in leadframe and method of making same |
Andy Quang Tran |
2016-12-06 |
$14,432,000 |
| 9171830 |
Fabricating a proximity sensor having light-blocking structure in leadframe |
Andy Quang Tran |
2015-10-27 |
$18,805,000 |
| 9111845 |
Integrated circuit package with printed circuit layer |
Matthew David Romig, Leslie Edward Stark, Frank Stepniak, Sreenivasan K. Koduri |
2015-08-18 |
$8,770,000 |
| 8994154 |
Proximity sensor having light blocking structure in leadframe |
Andy Quang Tran |
2015-03-31 |
$15,125,000 |
| 8945986 |
Electronic assembly with three dimensional inkjet printed traces |
Matthew David Romig, Leslie Edward Stark, Frank Stepniak, Sreenivasan K. Koduri |
2015-02-03 |
$21,082,000 |
| 8847349 |
Integrated circuit package with printed circuit layer |
Matthew David Romig, Leslie Edward Stark, Frank Stepniak, Screenivasan K. Koduri |
2014-09-30 |
$10,935,000 |
| 8816513 |
Electronic assembly with three dimensional inkjet printed traces |
Matthew David Romig, Leslie Edward Stark, Frank Stepniak, Sreenivasan K. Koduri |
2014-08-26 |
$9,823,000 |
| 8470644 |
Exposed die package for direct surface mounting |
Frank Yu, Chien-Te Feng, Sandra Horton |
2013-06-25 |
$4,096,000 |
| 8304871 |
Exposed die package for direct surface mounting |
Frank Yu, Chien-Te Feng, Sandra Horton |
2012-11-06 |
$2,604,000 |
| 7320903 |
Apparatus for and method of packaging semiconductor devices |
— |
2008-01-22 |
$17,897,000 |
| 7061108 |
Semiconductor device and a method for securing the device in a carrier tape |
Albert Escusa |
2006-06-13 |
$9,528,000 |
| 6977191 |
Apparatus for and method of packaging semiconductor devices |
— |
2005-12-20 |
$24,649,000 |
| 6774485 |
Apparatus for and method of packaging semiconductor devices |
— |
2004-08-10 |
$9,424,000 |
| 6292580 |
Efficient illumination system for wire bonders |
Sreenivasan K. Koduri, Joe D. Woodall, Charles K. Harris |
2001-09-18 |
$62,213,000 |
| 6042247 |
Efficient hybrid illuminator |
Sreenivasan K. Koduri, Joe D. Woodall, Charles K. Harris |
2000-03-28 |
$191,713,000 |