| 11769247 |
Exposed pad integrated circuit package |
Reynaldo Corpuz Javier, Alok Kumar Lohia |
2023-09-26 |
| 11195269 |
Exposed pad integrated circuit package |
Reynaldo Corpuz Javier, Alok Kumar Lohia |
2021-12-07 |
| 10580723 |
Flat no-lead packages with electroplated edges |
Reynaldo Corpuz Javier, Alok Kumar Lohia |
2020-03-03 |
| 10541194 |
Semiconductor package with interconnected leads |
Jeffrey Gail Holloway |
2020-01-21 |
| 10366947 |
Flat no-lead packages with electroplated edges |
Reynaldo Corpuz Javier, Alok Kumar Lohia |
2019-07-30 |
| 9768098 |
Packaged semiconductor device having stacked attached chips overhanging the assembly pad |
Alok Kumar Lohia, Reynaldo Corpuz Javier |
2017-09-19 |
| 9721859 |
Semi-hermetic semiconductor package |
Alok Kumar Lohia, Reynaldo Corpuz Javier |
2017-08-01 |
| 9608158 |
Proximity sensor having light-blocking structure in leadframe and method of making same |
Lance Cole Wright |
2017-03-28 |
| 9576886 |
Flat no-lead packages with electroplated edges |
Reynaldo Corpuz Javier, Alok Kumar Lohia |
2017-02-21 |
| 9515059 |
Proximity sensor having light-blocking structure in leadframe and method of making same |
Lance Cole Wright |
2016-12-06 |
| 9373569 |
Flat no-lead packages with electroplated edges |
Reynaldo Corpuz Javier, Alok Kumar Lohia |
2016-06-21 |
| 9219019 |
Packaged semiconductor devices having solderable lead surfaces exposed by grooves in package compound |
Alok Kumar Lohia, Reynaldo Corpuz Javier |
2015-12-22 |
| 9171830 |
Fabricating a proximity sensor having light-blocking structure in leadframe |
Lance Cole Wright |
2015-10-27 |
| 8994154 |
Proximity sensor having light blocking structure in leadframe |
Lance Cole Wright |
2015-03-31 |
| 8769469 |
System and method of crossover determination in differential pair and bondwire pairs to minimize crosstalk |
Gregory E. Howard, Yanli Fan, Kartheinz Muth |
2014-07-01 |