Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11769247 | Exposed pad integrated circuit package | Alok Kumar Lohia, Andy Quang Tran | 2023-09-26 |
| 11195269 | Exposed pad integrated circuit package | Alok Kumar Lohia, Andy Quang Tran | 2021-12-07 |
| 10580723 | Flat no-lead packages with electroplated edges | Alok Kumar Lohia, Andy Quang Tran | 2020-03-03 |
| 10366947 | Flat no-lead packages with electroplated edges | Alok Kumar Lohia, Andy Quang Tran | 2019-07-30 |
| 9768098 | Packaged semiconductor device having stacked attached chips overhanging the assembly pad | Alok Kumar Lohia, Andy Quang Tran | 2017-09-19 |
| 9721859 | Semi-hermetic semiconductor package | Andy Quang Tran, Alok Kumar Lohia | 2017-08-01 |
| 9576886 | Flat no-lead packages with electroplated edges | Alok Kumar Lohia, Andy Quang Tran | 2017-02-21 |
| 9373569 | Flat no-lead packages with electroplated edges | Alok Kumar Lohia, Andy Quang Tran | 2016-06-21 |
| 9219019 | Packaged semiconductor devices having solderable lead surfaces exposed by grooves in package compound | Alok Kumar Lohia, Andy Quang Tran | 2015-12-22 |