Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10541194 | Semiconductor package with interconnected leads | Andy Quang Tran | 2020-01-21 |
| 9627296 | Semiconductor package with cantilever leads | — | 2017-04-18 |
| 9240367 | Semiconductor package with cantilever leads | — | 2016-01-19 |
| 8232144 | Non-pull back pad package with an additional solder standoff | Bernhard Lange, Anthony L. Coyle | 2012-07-31 |
| 8216885 | Methods and devices for manufacturing cantilever leads in a semiconductor package | — | 2012-07-10 |
| 7608484 | Non-pull back pad package with an additional solder standoff | Bernhard Lange, Anthony L. Coyle | 2009-10-27 |
| 7504713 | Plastic semiconductor packages having improved metal land-locking features | Steven Kummerl | 2009-03-17 |