FY

Frank Yu

TI Texas Instruments: 7 patents #2,108 of 12,488Top 20%
TB The Boeing: 1 patents #8,242 of 15,756Top 55%
Overall (All Time): #630,924 of 4,157,543Top 20%
8
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
11081428 Electronic device with three dimensional thermal pad Stanley Shihyao Chou, Yuh-Harng Chien, Steven Kummerl, Bo-Hsun Pan, Pi-Chiang Huang +1 more 2021-08-03
10263648 Low cost millimeter wave receiver and method for operating same John E. Eng 2019-04-16
9272302 Mixing apparatus for mixing bonding adhesive at die bonder before dispense Eric Hsieh, Kevin Jin 2016-03-01
8668794 Mixing bonding adhesive at die bonder before dispense Eric Hsieh, Kevin Jin 2014-03-11
8470644 Exposed die package for direct surface mounting Lance Cole Wright, Chien-Te Feng, Sandra Horton 2013-06-25
8304871 Exposed die package for direct surface mounting Lance Cole Wright, Chien-Te Feng, Sandra Horton 2012-11-06
8058706 Delamination resistant packaged die having support and shaped die having protruding lip on support Chien-Te Feng, Kazuaki Ano, Trevor Liu 2011-11-15
8039955 Mold lock on heat spreader Chien-Te Feng 2011-10-18