| 11942448 |
Integrated circuit die pad cavity |
Hung-Yu Chou, Chung-Hao Lin, Yuh-Harng Chien |
2024-03-26 |
| 11862538 |
Semiconductor die mounted in a recess of die pad |
Chung-Hao Lin, Hung-Yu Chou, Dong-Ren Peng, Pi-Chiang Huang, Yuh-Harng Chien |
2024-01-02 |
| 11848297 |
Semiconductor device packages with high angle wire bonding and non-gold bond wires |
Chien-Chang Li, Hung-Yu Chou, Shawn O'Connor, Byron Lovell Williams, Jeffrey Alan West +2 more |
2023-12-19 |
| 11817374 |
Electronic device with exposed tie bar |
Chih-Chien Ho, Yuh-Harng Chien |
2023-11-14 |
| 11742265 |
Exposed heat-generating devices |
Hung-Yu Chou, Chi-Chen Chien, Yuh-Harng Chien, Steven Kummerl, Fu-Hua Yu |
2023-08-29 |
| 11735506 |
Packages with multiple exposed pads |
Hung-Yu Chou, Yuh-Harng Chien, Fu-Hua Yu, Steven Kummerl, Jie Chen +1 more |
2023-08-22 |
| 11081428 |
Electronic device with three dimensional thermal pad |
Stanley Shihyao Chou, Yuh-Harng Chien, Steven Kummerl, Pi-Chiang Huang, Frank Yu +1 more |
2021-08-03 |