| 12040197 |
Mechanical couplings designed to resolve process constraints |
Yuh-Harng Chien, Fu-Kang Lee, Steven Kummerl |
2024-07-16 |
| 11973052 |
Stud bump for wirebonding high voltage isolation barrier connection |
Chien-Chang Li, Sheng-Wen Huang, Zi-Xian Zhan, Byron Lovell Williams |
2024-04-30 |
| 11948721 |
Packaged isolation barrier with integrated magnetics |
Ying-Chuan Kao, Dong-Ren Peng, Jun Jie Kuo, Kenji Otake, Chih-Chien Ho |
2024-04-02 |
| 11942448 |
Integrated circuit die pad cavity |
Bo-Hsun Pan, Chung-Hao Lin, Yuh-Harng Chien |
2024-03-26 |
| 11862538 |
Semiconductor die mounted in a recess of die pad |
Chung-Hao Lin, Bo-Hsun Pan, Dong-Ren Peng, Pi-Chiang Huang, Yuh-Harng Chien |
2024-01-02 |
| 11848297 |
Semiconductor device packages with high angle wire bonding and non-gold bond wires |
Bo-Hsun Pan, Chien-Chang Li, Shawn O'Connor, Byron Lovell Williams, Jeffrey Alan West +2 more |
2023-12-19 |
| 11742265 |
Exposed heat-generating devices |
Chi-Chen Chien, Yuh-Harng Chien, Steven Kummerl, Bo-Hsun Pan, Fu-Hua Yu |
2023-08-29 |
| 11735506 |
Packages with multiple exposed pads |
Bo-Hsun Pan, Yuh-Harng Chien, Fu-Hua Yu, Steven Kummerl, Jie Chen +1 more |
2023-08-22 |
| 11421981 |
Single wavelength reflection for leadframe brightness measurement |
Chien-Hao Wang, Tse-Tsun Chiu, Fu-Kang Lee, Liang-Kang Su |
2022-08-23 |
| 10861777 |
Wire bond clamp design and lead frame capable of engaging with same |
Yuh-Harng Chien, Fu-Kang Lee |
2020-12-08 |
| 10429174 |
Single wavelength reflection for leadframe brightness measurement |
Chien-Hao Wang, Tse-Tsun Chiu, Fu-Kang Lee, Liang-Kang Su |
2019-10-01 |
| 10340152 |
Mechanical couplings designed to resolve process constraints |
Yuh-Harng Chien, Fu-Kang Lee, Steven Kummerl |
2019-07-02 |
| 7612506 |
Method for controlling light-emission of a light-emitting diode light source |
Tsung-Hsun Yang |
2009-11-03 |
| 6757012 |
Color selection for sparse color image reconstruction |
Thomas Eugene Hubina, Craig C. Reinhart |
2004-06-29 |