Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040197 | Mechanical couplings designed to resolve process constraints | Hung-Yu Chou, Fu-Kang Lee, Steven Kummerl | 2024-07-16 |
| 11942448 | Integrated circuit die pad cavity | Bo-Hsun Pan, Hung-Yu Chou, Chung-Hao Lin | 2024-03-26 |
| 11862538 | Semiconductor die mounted in a recess of die pad | Chung-Hao Lin, Hung-Yu Chou, Bo-Hsun Pan, Dong-Ren Peng, Pi-Chiang Huang | 2024-01-02 |
| 11817374 | Electronic device with exposed tie bar | Chih-Chien Ho, Bo-Hsun Pan | 2023-11-14 |
| 11742265 | Exposed heat-generating devices | Hung-Yu Chou, Chi-Chen Chien, Steven Kummerl, Bo-Hsun Pan, Fu-Hua Yu | 2023-08-29 |
| 11735506 | Packages with multiple exposed pads | Hung-Yu Chou, Bo-Hsun Pan, Fu-Hua Yu, Steven Kummerl, Jie Chen +1 more | 2023-08-22 |
| 11538740 | Leads for semiconductor package | Jason Chien, J K Ho | 2022-12-27 |
| 11444012 | Packaged electronic device with split die pad in robust package substrate | Chang-Yen Ko, Chih-Chien Ho | 2022-09-13 |
| 11081428 | Electronic device with three dimensional thermal pad | Stanley Shihyao Chou, Steven Kummerl, Bo-Hsun Pan, Pi-Chiang Huang, Frank Yu +1 more | 2021-08-03 |
| 11081429 | Finger pad leadframe | Jason Chien, J K Ho | 2021-08-03 |
| 10957631 | Angled die pad of a leadframe for a molded integrated circuit package | Chung Ming Cheng, Fu-Kang Lee, Chia-Yu Chang | 2021-03-23 |
| 10861777 | Wire bond clamp design and lead frame capable of engaging with same | Hung-Yu Chou, Fu-Kang Lee | 2020-12-08 |
| 10811343 | Method of making a wire support leadframe for a semiconductor device | Chih-Chien Ho, Steven Su | 2020-10-20 |
| 10573581 | Leadframe | Chih-Chien Ho, Chung-Hao Lin | 2020-02-25 |
| 10529654 | Wire support for a leadframe | Chih-Chien Ho, Steven Su | 2020-01-07 |
| 10340152 | Mechanical couplings designed to resolve process constraints | Hung-Yu Chou, Fu-Kang Lee, Steven Kummerl | 2019-07-02 |
| 10229868 | Method of making a wire support leadframe for a semiconductor device | Chih-Chien Ho, Steven Su | 2019-03-12 |
| 10121733 | Wire support for a leadframe | Chih-Chien Ho, Steven Su | 2018-11-06 |
| 9627331 | Method of making a wire support leadframe for a semiconductor device | Chih-Chien Ho, Steven Su | 2017-04-18 |