Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12293953 | Edge bend for isolation packages | John Paul Tellkamp | 2025-05-06 |
| 11935789 | Method of floated singulation | J K Ho | 2024-03-19 |
| 11699649 | Electronic device having inverted lead pins | J K Ho | 2023-07-11 |
| 11538743 | Microelectronic device with floating pads | JK Ho | 2022-12-27 |
| 11444012 | Packaged electronic device with split die pad in robust package substrate | Yuh-Harng Chien, Chih-Chien Ho | 2022-09-13 |
| 11437303 | Floated singulation | J K Ho | 2022-09-06 |
| 11183450 | Electronic device having inverted lead pins | J K Ho | 2021-11-23 |
| 10854538 | Microelectronic device with floating pads | JK Ho | 2020-12-01 |
| 10714418 | Electronic device having inverted lead pins | J K Ho | 2020-07-14 |
| 10395971 | Dam laminate isolation substrate | Chung Ming Cheng, Megan Chang, Chih-Chien Ho | 2019-08-27 |