Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12336231 | Inverted leads for packaged isolation devices | Andrew Patrick Couch | 2025-06-17 |
| 12293953 | Edge bend for isolation packages | Chang-Yen Ko | 2025-05-06 |
| 12009336 | Packages with electrical fuses | Mahmud Halim Chowdhury, Amin Ahmad Sijelmassi, Murali Kittappa, Anindya Poddar, Honglin Guo +1 more | 2024-06-11 |
| 11658243 | Inverted leads for packaged isolation devices | Andrew Patrick Couch | 2023-05-23 |
| 11574884 | Multi-function bond pad | Suvadip Banerjee | 2023-02-07 |
| 11569153 | Leadframes with folded conductor portion and devices therefrom | Enis Tuncer | 2023-01-31 |
| 11557722 | Hall-effect sensor package with added current path | Ming Li, Yiqi Tang, Jie Chen, Enis Tuncer, Usman Mahmood Chaudhry +3 more | 2023-01-17 |
| 10892405 | Hall-effect sensor package with added current path | Ming Li, Yiqi Tang, Jie Chen, Enis Tuncer, Usman Mahmood Chaudhry +3 more | 2021-01-12 |
| 10439065 | Inverted leads for packaged isolation devices | Andrew Patrick Couch | 2019-10-08 |
| 9239353 | Testing of integrated circuits with external clearance requirements | — | 2016-01-19 |
| 8753924 | Grown carbon nanotube die attach structures, articles, devices, and processes for making them | James Cooper Wainerdi, Luigi Colombo, Robert Reid Doering | 2014-06-17 |
| 8378506 | Packaged electronic device having metal comprising self-healing die attach material | James Cooper Wainerdi | 2013-02-19 |
| 8377747 | Interleaf for leadframe identification | — | 2013-02-19 |
| 8129227 | Semiconductor device having grooved leads to confine solder wicking | — | 2012-03-06 |
| 7972905 | Packaged electronic device having metal comprising self-healing die attach material | James Cooper Wainerdi | 2011-07-05 |
| 7821111 | Semiconductor device having grooved leads to confine solder wicking | — | 2010-10-26 |
| 7550852 | Composite metal column for mounting semiconductor device | Akira Matsunami | 2009-06-23 |
| 7413934 | Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices | — | 2008-08-19 |
| 7256117 | Method for evaluating and modifying solder attach design for integrated circuit packaging assembly | — | 2007-08-14 |
| 7256481 | Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices | — | 2007-08-14 |
| 7166481 | Method for evaluating and modifying solder attach design for integrated circuit packaging assembly | — | 2007-01-23 |
| 7125789 | Composite metal column for mounting semiconductor device | Akira Matsunami | 2006-10-24 |
| 7095121 | Metallic strain-absorbing layer for improved fatigue resistance of solder-attached devices | — | 2006-08-22 |
| 7044304 | Anti-corrosion overcoat cover tape | Clessie A. Troxtell, Jr. | 2006-05-16 |
| 7012018 | Metallic strain-absorbing layer for improved fatigue resistance of solder-attached devices | — | 2006-03-14 |