Issued Patents All Time
Showing 25 most recent of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266595 | Semiconductor device package with isolated semiconductor die and electric field curtailment | — | 2025-04-01 |
| 12243911 | Integrated circuit package for isolation dies | Matthew David Romig, Rajen Manicon Murugan, Yiqi Tang | 2025-03-04 |
| 12191252 | Semiconductor fuse with multi-bond wire | — | 2025-01-07 |
| 12183693 | Integrated magnetic assembly with conductive field plates | — | 2024-12-31 |
| 12170164 | Integrated high voltage electronic device with high relative permittivity layers | — | 2024-12-17 |
| 12027572 | Integrated semiconductor device isolation package | — | 2024-07-02 |
| 11935844 | Semiconductor device and method of the same | — | 2024-03-19 |
| 11879790 | Isolated temperature sensor package with embedded spacer in dielectric opening | — | 2024-01-23 |
| 11881445 | High voltage semiconductor device lead frame and method of fabrication | — | 2024-01-23 |
| 11881461 | Electric field control for bond pads in semiconductor device package | — | 2024-01-23 |
| 11838004 | Acoustic device package and method of making | Abram Castro | 2023-12-05 |
| 11756882 | Semiconductor die with blast shielding | Alejandro Hernandez-Luna | 2023-09-12 |
| 11728289 | Integrated magnetic assembly with conductive field plates | — | 2023-08-15 |
| 11658101 | Isolated temperature sensor device package | — | 2023-05-23 |
| 11621215 | Semiconductor device package with isolated semiconductor die and electric field curtailment | — | 2023-04-04 |
| 11614482 | Method for manufacturing semiconductor device package with isolation | — | 2023-03-28 |
| 11598742 | Semiconductor device for sensing impedance changes in a medium | Vikas Gupta | 2023-03-07 |
| 11594474 | Bondwire protrusions on conductive members | — | 2023-02-28 |
| 11573203 | Humidity sensor | — | 2023-02-07 |
| 11569153 | Leadframes with folded conductor portion and devices therefrom | John Paul Tellkamp | 2023-01-31 |
| 11569396 | Optical sensor package with optically transparent mold compound | — | 2023-01-31 |
| 11557722 | Hall-effect sensor package with added current path | Ming Li, Yiqi Tang, Jie Chen, Usman Mahmood Chaudhry, Tony R. Larson +3 more | 2023-01-17 |
| 11552013 | Fuses for packaged semiconductor devices | — | 2023-01-10 |
| 11538738 | Isolated temperature sensor device | — | 2022-12-27 |
| 11342251 | Isolated component design | — | 2022-05-24 |