Issued Patents All Time
Showing 25 most recent of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087673 | QFN device having a mechanism that enables an inspectable solder joint when attached to a PWB and method of making same | Usman Mahmood Chaudhry, Joe Adam Garcia, Mahmud Halim Chowdhury | 2024-09-10 |
| 11854947 | Integrated circuit chip with a vertical connector | Steven Kummerl | 2023-12-26 |
| 11838004 | Acoustic device package and method of making | Enis Tuncer | 2023-12-05 |
| 11830793 | Multi-lead adapter | Sreenivasan K. Koduri | 2023-11-28 |
| 11552005 | Integrated circuit package electronic device | — | 2023-01-10 |
| 11495524 | QFN device having a mechanism that enables an inspectable solder joint when attached to a PWB and method of making same | Usman Mahmood Chaudhry, Joe Adam Garcia, Mahmud Halim Chowdhury | 2022-11-08 |
| 11177195 | Multi-lead adapter | Sreenivasan K. Koduri | 2021-11-16 |
| 11088052 | Integrated circuit package electronic device including pillar contacts and electrical terminations | — | 2021-08-10 |
| 10804185 | Integrated circuit chip with a vertical connector | Steven Kummerl | 2020-10-13 |
| 10756013 | Packaged semiconductor system having unidirectional connections to discrete components | Saumya Gandhi, Matthew David Romig | 2020-08-25 |
| 10727085 | Printed adhesion deposition to mitigate integrated circuit package delamination | Yong Lin, Rongwei Zhang, Benjamin Stassen Cook | 2020-07-28 |
| 10566276 | Packaged semiconductor system having unidirectional connections to discrete components | Saumya Gandhi, Matthew David Romig | 2020-02-18 |
| 10347508 | Printed adhesion deposition to mitigate integrated circuit delamination | Yong Lin, Rongwei Zhang, Benjamin Stassen Cook | 2019-07-09 |
| 10284172 | Acoustic device package and method of making | Enis Tuncer | 2019-05-07 |
| 10199348 | Plastic-packaged semiconductor device having wires with polymerized insulating layer | Rongwei Zhang | 2019-02-05 |
| 9875930 | Method of packaging a circuit | Bernardo Gallegos | 2018-01-23 |
| 9780017 | Packaged device with additive substrate surface modification | Benjamin Stassen Cook, Juan Alejandro Herbsommer, Yong Lin, Rongwei Zhang, Matthew David Romig | 2017-10-03 |
| 9601414 | Method for preventing die pad delamination | Rongwei Zhang | 2017-03-21 |
| 9536781 | Method of making integrated circuit | Bernardo Gallegos | 2017-01-03 |
| 9524926 | Packaged device with additive substrate surface modification | Benjamin Stassen Cook, Juan Alejandro Herbsommer, Yong Lin, Rongwei Zhang, Matthew David Romig | 2016-12-20 |
| 9378984 | Packaging a semiconductor device having wires with polymerized insulator skin | Rongwei Zhang | 2016-06-28 |
| 9305869 | Packaged semiconductor device having leadframe features as pressure valves against delamination | Rongwei Zhang | 2016-04-05 |
| 9214440 | Method for preventing die pad delamination | Rongwei Zhang | 2015-12-15 |
| 9142472 | Integrated circuit and method of making | Bernardo Gallegos | 2015-09-22 |
| 9129955 | Semiconductor flip-chip system having oblong connectors and reduced trace pitches | Mark A. Gerber | 2015-09-08 |