Abram Castro — 38 Patents at Texas Instruments

Abram Castro has been granted 38 US patents while listed as an inventor at Texas Instruments. The first was granted in 1997 and the most recent in September 2024. Abram Castro ranks #84,675 of 4,157,543 US inventors in our database (top 2.0%). Patent records list Abram Castro in Fort Worth, TX, US.

Issued Patents All Time

Showing 1–25 of 38 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12087673	QFN device having a mechanism that enables an inspectable solder joint when attached to a PWB and method of making same	Usman Mahmood Chaudhry, Joe Adam Garcia, Mahmud Halim Chowdhury	2024-09-10	$30,309,000
11854947	Integrated circuit chip with a vertical connector	Steven Kummerl	2023-12-26	$25,539,000
11838004	Acoustic device package and method of making	Enis Tuncer	2023-12-05	$30,679,000
11830793	Multi-lead adapter	Sreenivasan K. Koduri	2023-11-28	$42,799,000
11552005	Integrated circuit package electronic device	—	2023-01-10	$36,479,000
11495524	QFN device having a mechanism that enables an inspectable solder joint when attached to a PWB and method of making same	Usman Mahmood Chaudhry, Joe Adam Garcia, Mahmud Halim Chowdhury	2022-11-08	$30,904,000
11177195	Multi-lead adapter	Sreenivasan K. Koduri	2021-11-16	$40,327,000
11088052	Integrated circuit package electronic device including pillar contacts and electrical terminations	—	2021-08-10	$40,116,000
10804185	Integrated circuit chip with a vertical connector	Steven Kummerl	2020-10-13	$33,902,000
10756013	Packaged semiconductor system having unidirectional connections to discrete components	Saumya Gandhi, Matthew David Romig	2020-08-25	$38,679,000
10727085	Printed adhesion deposition to mitigate integrated circuit package delamination	Yong Lin, Rongwei Zhang, Benjamin Stassen Cook	2020-07-28	$26,870,000
10566276	Packaged semiconductor system having unidirectional connections to discrete components	Saumya Gandhi, Matthew David Romig	2020-02-18	$34,774,000
10347508	Printed adhesion deposition to mitigate integrated circuit delamination	Yong Lin, Rongwei Zhang, Benjamin Stassen Cook	2019-07-09	$33,407,000
10284172	Acoustic device package and method of making	Enis Tuncer	2019-05-07	$29,292,000
10199348	Plastic-packaged semiconductor device having wires with polymerized insulating layer	Rongwei Zhang	2019-02-05	$20,780,000
9875930	Method of packaging a circuit	Bernardo Gallegos	2018-01-23	$33,509,000
9780017	Packaged device with additive substrate surface modification	Benjamin Stassen Cook, Juan Alejandro Herbsommer, Yong Lin, Rongwei Zhang, Matthew David Romig	2017-10-03	$15,808,000
9601414	Method for preventing die pad delamination	Rongwei Zhang	2017-03-21	$9,568,000
9536781	Method of making integrated circuit	Bernardo Gallegos	2017-01-03	$14,626,000
9524926	Packaged device with additive substrate surface modification	Benjamin Stassen Cook, Juan Alejandro Herbsommer, Yong Lin, Rongwei Zhang, Matthew David Romig	2016-12-20	$18,500,000
9378984	Packaging a semiconductor device having wires with polymerized insulator skin	Rongwei Zhang	2016-06-28	$16,410,000
9305869	Packaged semiconductor device having leadframe features as pressure valves against delamination	Rongwei Zhang	2016-04-05	$12,005,000
9214440	Method for preventing die pad delamination	Rongwei Zhang	2015-12-15	$26,830,000
9142472	Integrated circuit and method of making	Bernardo Gallegos	2015-09-22	$9,107,000
9129955	Semiconductor flip-chip system having oblong connectors and reduced trace pitches	Mark A. Gerber	2015-09-08	$8,388,000

12 Next »

Abram Castro — 38 Patents

Issued Patents All Time

Patent Widget