Issued Patents All Time
Showing 26–38 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8530360 | Method for low stress flip-chip assembly of fine-pitch semiconductor devices | — | 2013-09-10 |
| 8133761 | Packaged system of semiconductor chips having a semiconductor interposer | Mark A. Gerber, Kurt Peter Wachtler | 2012-03-13 |
| 7898083 | Method for low stress flip-chip assembly of fine-pitch semiconductor devices | — | 2011-03-01 |
| 7573139 | Packed system of semiconductor chips having a semiconductor interposer | Mark A. Gerber, Kurt Peter Wachtler | 2009-08-11 |
| 7569918 | Semiconductor package-on-package system including integrated passive components | Mark A. Gerber, Kurt Peter Wachtler | 2009-08-04 |
| 7390700 | Packaged system of semiconductor chips having a semiconductor interposer | Mark A. Gerber, Kurt Peter Wachtler | 2008-06-24 |
| 6801438 | Electrical circuit and method of formation | — | 2004-10-05 |
| 6534861 | Ball grid substrate for lead-on-chip semiconductor package | — | 2003-03-18 |
| 6501168 | Substrate for an integrated circuit package | Aaron R. Castro | 2002-12-31 |
| 6300165 | Ball grid substrate for lead-on-chip semiconductor package | — | 2001-10-09 |
| 6248612 | Method for making a substrate for an integrated circuit package | Aaron R. Castro | 2001-06-19 |
| 6107683 | Sequentially built integrated circuit package | Aaron R. Castro | 2000-08-22 |
| 5650593 | Thermally enhanced chip carrier package | John R. McMillan, William H. Maslakow | 1997-07-22 |