Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Printed adhesion deposition to mitigate integrated circuit delamination

Printed adhesion deposition to mitigate integrated circuit delamination

US Patent 10347508 · Granted Jul 9, 2019

Estimated economic value: $33,407,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semicondctor device package thermal conduit2025
3D printed semiconductor package2025
Method for realizing high-speed cladding of hollow offset-focus annular laser2025
Integrated filter optical package2025
IC package with heat spreader2025
Sensor packages with wavelength-specific light filters2025
Package heat dissipation including a die attach film2025
Electronic sensors with sensor die in package structure cavity2025
Acoustic waveguide with diffraction grating2025
Additive process for circular printing2024
Floating die package2024
Through wafer trench isolation between transistors in an integrated circuit2024