Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10727085 | Printed adhesion deposition to mitigate integrated circuit package delamination | Rongwei Zhang, Benjamin Stassen Cook, Abram Castro | 2020-07-28 |
| 10636679 | Packaged semiconductor device having nanoparticle adhesion layer patterned into zones of electrical conductance and insulation | Benjamin Stassen Cook | 2020-04-28 |
| 10354890 | Packaged semiconductor device having nanoparticle adhesion layer patterned into zones of electrical conductance and insulation | Benjamin Stassen Cook | 2019-07-16 |
| 10347508 | Printed adhesion deposition to mitigate integrated circuit delamination | Rongwei Zhang, Benjamin Stassen Cook, Abram Castro | 2019-07-09 |
| 10147672 | Lead frame surface modifications for high voltage isolation | Sadia Arefin Khan, Benjamin Stassen Cook | 2018-12-04 |
| 9865527 | Packaged semiconductor device having nanoparticle adhesion layer patterned into zones of electrical conductance and insulation | Benjamin Stassen Cook | 2018-01-09 |
| 9780017 | Packaged device with additive substrate surface modification | Benjamin Stassen Cook, Juan Alejandro Herbsommer, Rongwei Zhang, Abram Castro, Matthew David Romig | 2017-10-03 |
| 9780060 | Packaged IC with solderable sidewalls | Vikas Gupta, Rongwei Zhang | 2017-10-03 |
| 9524926 | Packaged device with additive substrate surface modification | Benjamin Stassen Cook, Juan Alejandro Herbsommer, Rongwei Zhang, Abram Castro, Matthew David Romig | 2016-12-20 |
| 9054092 | Method and apparatus for stopping resin bleed and mold flash on integrated circuit lead finishes | Bernardo Gallegos | 2015-06-09 |