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Packaged semiconductor device having nanoparticle adhesion layer patterned into zones of electrical conductance and insulation |
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Packaged semiconductor device having nanoparticle adhesion layer patterned into zones of electrical conductance and insulation |
Benjamin Stassen Cook |
2019-07-16 |
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Printed adhesion deposition to mitigate integrated circuit delamination |
Rongwei Zhang, Benjamin Stassen Cook, Abram Castro |
2019-07-09 |
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Lead frame surface modifications for high voltage isolation |
Sadia Arefin Khan, Benjamin Stassen Cook |
2018-12-04 |
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Packaged semiconductor device having nanoparticle adhesion layer patterned into zones of electrical conductance and insulation |
Benjamin Stassen Cook |
2018-01-09 |
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Packaged device with additive substrate surface modification |
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2017-10-03 |
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2017-10-03 |
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Packaged device with additive substrate surface modification |
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Method and apparatus for stopping resin bleed and mold flash on integrated circuit lead finishes |
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